Search Results for Packaging. - Narrowed by: Microtechnology.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dPackaging.$0026qf$003dSUBJECT$002509Subject$002509Microtechnology.$002509Microtechnology.$0026te$003dILS$0026ps$003d300?dt=list
2026-03-20T23:53:36Z
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:611028
2026-03-20T23:53:36Z
2026-03-20T23:53:36Z
Author Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Chiplet Design and Heterogeneous Integration Packaging
ent://SD_ILS/0/SD_ILS:527684
2026-03-20T23:53:36Z
2026-03-20T23:53:36Z
Author Lau, John H. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
3D Microelectronic Packaging From Fundamentals to Applications
ent://SD_ILS/0/SD_ILS:613043
2026-03-20T23:53:36Z
2026-03-20T23:53:36Z
Author Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-44586-1">https://doi.org/10.1007/978-3-319-44586-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
ent://SD_ILS/0/SD_ILS:529887
2026-03-20T23:53:36Z
2026-03-20T23:53:36Z
Author Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>