Search Results for Packaging. - Narrowed by: Optical materials. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dPackaging.$0026qf$003dSUBJECT$002509Subject$002509Optical$002bmaterials.$002509Optical$002bmaterials.$0026te$003dILS$0026ps$003d300?dt=list 2024-12-23T08:26:56Z Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:167565 2024-12-23T08:26:56Z 2024-12-23T08:26:56Z Author&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-78219-5">http://dx.doi.org/10.1007/978-0-387-78219-5</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advanced Flip Chip Packaging ent://SD_ILS/0/SD_ILS:330808 2024-12-23T08:26:56Z 2024-12-23T08:26:56Z Author&#160;Tong, Ho-Ming. editor.&#160;Lai, Yi-Shao. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE(330808.1)<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Fan-Out Wafer-Level Packaging ent://SD_ILS/0/SD_ILS:399728 2024-12-23T08:26:56Z 2024-12-23T08:26:56Z Author&#160;Lau, John H. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-10-8884-1">https://doi.org/10.1007/978-981-10-8884-1</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Integrated Circuit Packaging, Assembly and Interconnections ent://SD_ILS/0/SD_ILS:165984 2024-12-23T08:26:56Z 2024-12-23T08:26:56Z Author&#160;Greig, William J. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/0-387-33913-2">http://dx.doi.org/10.1007/0-387-33913-2</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Force Sensors for Microelectronic Packaging Applications ent://SD_ILS/0/SD_ILS:181096 2024-12-23T08:26:56Z 2024-12-23T08:26:56Z Author&#160;Schwizer, J&uuml;rg. author.&#160;Mayer, Michael. author.&#160;Brand, Oliver. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Modeling and Application of Flexible Electronics Packaging ent://SD_ILS/0/SD_ILS:484436 2024-12-23T08:26:56Z 2024-12-23T08:26:56Z Author&#160;Huang, YongAn. author.&#160;Yin, Zhouping. author.&#160;Wan, Xiaodong. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-13-3627-0">https://doi.org/10.1007/978-981-13-3627-0</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging ent://SD_ILS/0/SD_ILS:196467 2024-12-23T08:26:56Z 2024-12-23T08:26:56Z Author&#160;Gerlach, Gerald. editor.&#160;Wolter, Klaus-J&uuml;rgen. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-3-642-28522-6">http://dx.doi.org/10.1007/978-3-642-28522-6</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advanced Materials for Thermal Management of Electronic Packaging ent://SD_ILS/0/SD_ILS:172970 2024-12-23T08:26:56Z 2024-12-23T08:26:56Z Author&#160;Tong, Xingcun Colin. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-7759-5">http://dx.doi.org/10.1007/978-1-4419-7759-5</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ent://SD_ILS/0/SD_ILS:165900 2024-12-23T08:26:56Z 2024-12-23T08:26:56Z Author&#160;Suhir, E. editor.&#160;Lee, Y. C. editor.&#160;Wong, C. P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/>