Search Results for Packaging. - Narrowed by: System safety.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dPackaging.$0026qf$003dSUBJECT$002509Subject$002509System$002bsafety.$002509System$002bsafety.$0026ps$003d300?dt=list
2026-04-05T19:45:37Z
Force Sensors for Microelectronic Packaging Applications
ent://SD_ILS/0/SD_ILS:181096
2026-04-05T19:45:37Z
2026-04-05T19:45:37Z
Author Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2026-04-05T19:45:37Z
2026-04-05T19:45:37Z
Author Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>