Search Results for Packaging. - Narrowed by: Systems engineering.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dPackaging.$0026qf$003dSUBJECT$002509Subject$002509Systems$002bengineering.$002509Systems$002bengineering.$0026ic$003dtrue$0026te$003dILS$0026ps$003d300?
2025-12-26T11:28:26Z
Advanced Flip Chip Packaging
ent://SD_ILS/0/SD_ILS:330808
2025-12-26T11:28:26Z
2025-12-26T11:28:26Z
Author Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE(330808.1)<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Fan-Out Wafer-Level Packaging
ent://SD_ILS/0/SD_ILS:399728
2025-12-26T11:28:26Z
2025-12-26T11:28:26Z
Author Lau, John H. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-10-8884-1">https://doi.org/10.1007/978-981-10-8884-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
RF and Microwave Microelectronics Packaging
ent://SD_ILS/0/SD_ILS:172116
2025-12-26T11:28:26Z
2025-12-26T11:28:26Z
Author Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-0984-8">http://dx.doi.org/10.1007/978-1-4419-0984-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Integrated Circuit Packaging, Assembly and Interconnections
ent://SD_ILS/0/SD_ILS:165984
2025-12-26T11:28:26Z
2025-12-26T11:28:26Z
Author Greig, William J. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-33913-2">http://dx.doi.org/10.1007/0-387-33913-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
ent://SD_ILS/0/SD_ILS:173841
2025-12-26T11:28:26Z
2025-12-26T11:28:26Z
Author Liu, Yong. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4614-1053-9">http://dx.doi.org/10.1007/978-1-4614-1053-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>