Search Results for Packaging. - Narrowed by: Telecommunication.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dPackaging.$0026qf$003dSUBJECT$002509Subject$002509Telecommunication.$002509Telecommunication.$0026ps$003d300?dt=list
2026-03-28T17:56:49Z
MEMS Packaging
ent://SD_ILS/0/SD_ILS:247779
2026-03-28T17:56:49Z
2026-03-28T17:56:49Z
Author Tai-Ran Hsu, ed.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1049/PBEP003E">http://dx.doi.org/10.1049/PBEP003E</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
RF and Microwave Microelectronics Packaging II
ent://SD_ILS/0/SD_ILS:616783
2026-03-28T17:56:49Z
2026-03-28T17:56:49Z
Author Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-51697-4">https://doi.org/10.1007/978-3-319-51697-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
ent://SD_ILS/0/SD_ILS:529887
2026-03-28T17:56:49Z
2026-03-28T17:56:49Z
Author Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Enabling the Internet of Things From Integrated Circuits to Integrated Systems
ent://SD_ILS/0/SD_ILS:616591
2026-03-28T17:56:49Z
2026-03-28T17:56:49Z
Author Alioto, Massimo. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-51482-6">https://doi.org/10.1007/978-3-319-51482-6</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>