Search Results for Reliability. - Narrowed by: Electronic packaging.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dReliability.$0026qf$003dSUBJECT$002509Subject$002509Electronic$002bpackaging.$002509Electronic$002bpackaging.$0026ic$003dtrue$0026ps$003d300?
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Lead-free soldering process development and reliability
ent://SD_ILS/0/SD_ILS:595935
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Author Bath, Jasbir, editor.<br/>Preferred Shelf Number TK7870.15 .L434 2020<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Adhesives technology for electronic applications materials, processes, reliability
ent://SD_ILS/0/SD_ILS:256461
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Author Licari, James J., 1930- Swanson, Dale W.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780815515135">http://www.sciencedirect.com/science/book/9780815515135</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Electronic packaging science and technology
ent://SD_ILS/0/SD_ILS:597053
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Author Tu, K. N. (King-Ning), 1937- author. Chen, Chih, 1970- author. Chen, Hung-Ming, author.<br/>Preferred Shelf Number TK7870.15 .T85 2022<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Thermal and structural electronic packaging analysis for space and extreme environments
ent://SD_ILS/0/SD_ILS:579090
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Author Cepeda-Rizo, Juan, author. Gayle, Jeremiah, author. Ravich, Joshua, author.<br/>Preferred Shelf Number TK7870.15<br/>Electronic Access Taylor & Francis <a href="https://www.taylorfrancis.com/books/9781003247005">https://www.taylorfrancis.com/books/9781003247005</a>
OCLC metadata license agreement <a href="http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf">http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Practical guide to the packaging of electronics : thermal and mechanical design and analysis
ent://SD_ILS/0/SD_ILS:539683
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Author Jamnia, Ali, 1961- author.<br/>Preferred Shelf Number TK7870.15 .J36 2009<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781420065404">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
Handbook of lead-free solder technology for microelectronic assemblies
ent://SD_ILS/0/SD_ILS:547812
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Author Puttlitz, Karl J. Stalter, Kathleen A.<br/>Preferred Shelf Number TK7870.15 .H3657 2004<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781135536855">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>