Search Results for Safety. - Narrowed by: Electronics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dSafety.$0026qf$003dSUBJECT$002509Subject$002509Electronics.$002509Electronics.$0026pe$003dd$00253A$0026ps$003d300$0026isd$003dtrue?
2024-11-13T19:15:19Z
Geomagnetics for Aeronautical Safety A Case Study in and around the Balkans
ent://SD_ILS/0/SD_ILS:169350
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Author Rasson, Jean L. editor. Delipetrov, Todor. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4020-5025-1">http://dx.doi.org/10.1007/978-1-4020-5025-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Advanced Microsystems for Automotive Applications 2009 Smart Systems for Safety, Sustainability, and Comfort
ent://SD_ILS/0/SD_ILS:189792
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Author Meyer, Gereon. editor. Valldorf, Jürgen. editor. Gessner, Wolfgang. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-3-642-00745-3">http://dx.doi.org/10.1007/978-3-642-00745-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Dependable Multicore Architectures at Nanoscale
ent://SD_ILS/0/SD_ILS:402190
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Author Ottavi, Marco. editor. Gizopoulos, Dimitris. editor. Pontarelli, Salvatore. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-54422-9">https://doi.org/10.1007/978-3-319-54422-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Bias Temperature Instability for Devices and Circuits
ent://SD_ILS/0/SD_ILS:484755
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Author Grasser, Tibor. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-1-4614-7909-3">https://doi.org/10.1007/978-1-4614-7909-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
ent://SD_ILS/0/SD_ILS:488642
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Author Balasinski, Artur. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-1-4614-1761-3">https://doi.org/10.1007/978-1-4614-1761-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Reliability Engineering Theory and Practice
ent://SD_ILS/0/SD_ILS:489410
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Author Birolini, Alessandro. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-642-39535-2">https://doi.org/10.1007/978-3-642-39535-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Reliability Physics and Engineering Time-To-Failure Modeling
ent://SD_ILS/0/SD_ILS:332682
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Author McPherson, J. W. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE(332682.1)<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-3-319-00122-7">http://dx.doi.org/10.1007/978-3-319-00122-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
ent://SD_ILS/0/SD_ILS:168463
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Author Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-85729-236-0">http://dx.doi.org/10.1007/978-0-85729-236-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
ent://SD_ILS/0/SD_ILS:168486
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Author Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-85729-310-7">http://dx.doi.org/10.1007/978-0-85729-310-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Reliability of Microtechnology Interconnects, Devices and Systems
ent://SD_ILS/0/SD_ILS:172420
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Author Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-5760-3">http://dx.doi.org/10.1007/978-1-4419-5760-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Reliability Engineering Theory and Practice
ent://SD_ILS/0/SD_ILS:192824
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Author Birolini, Alessandro. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-3-642-14952-8">http://dx.doi.org/10.1007/978-3-642-14952-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Reliability Physics and Engineering Time-To-Failure Modeling
ent://SD_ILS/0/SD_ILS:172571
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Author McPherson, J.W. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-6348-2">http://dx.doi.org/10.1007/978-1-4419-6348-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Solder Joint Reliability Prediction for Multiple Environments
ent://SD_ILS/0/SD_ILS:167673
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Author Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-79394-8">http://dx.doi.org/10.1007/978-0-387-79394-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Montage in der Leistungselektronik für globale Märkte Design, Konzepte, Strategien
ent://SD_ILS/0/SD_ILS:188952
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Author Feldmann, Klaus. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-3-540-87972-5">http://dx.doi.org/10.1007/978-3-540-87972-5</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Precision Manufacturing
ent://SD_ILS/0/SD_ILS:166555
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Author Dornfeld, David. author. Lee, Dae-Eun. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-68208-2">http://dx.doi.org/10.1007/978-0-387-68208-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Emerging Nanotechnologies Test, Defect Tolerance, and Reliability
ent://SD_ILS/0/SD_ILS:167204
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Author Tehranipoor, Mohammad. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-74747-7">http://dx.doi.org/10.1007/978-0-387-74747-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
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Author Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
ent://SD_ILS/0/SD_ILS:166405
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Author Subramanian, K. N. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-48433-4">http://dx.doi.org/10.1007/978-0-387-48433-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
A Guide to Lead-free Solders Physical Metallurgy and Reliability
ent://SD_ILS/0/SD_ILS:175373
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Author Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-84628-310-9">http://dx.doi.org/10.1007/978-1-84628-310-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Solder Joint Technology Materials, Properties, and Reliability
ent://SD_ILS/0/SD_ILS:166252
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Author Tu, King-Ning. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-38892-2">http://dx.doi.org/10.1007/978-0-387-38892-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Reliability Engineering Theory and Practice
ent://SD_ILS/0/SD_ILS:185203
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Author Birolini, Alessandro. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-3-540-49390-7">http://dx.doi.org/10.1007/978-3-540-49390-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Electronics Process Technology Production Modelling, Simulation and Optimisation
ent://SD_ILS/0/SD_ILS:175397
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Author Sauer, Wilfried. author. Oppermann, Martin. author. Werner, Sebastian. author. Wohlrabe, Heinz. author. Zerna, Thomas. author.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/1-84628-354-X">http://dx.doi.org/10.1007/1-84628-354-X</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Force Sensors for Microelectronic Packaging Applications
ent://SD_ILS/0/SD_ILS:181096
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Author Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Green electronics/green bottom line environmentally responsible engineering
ent://SD_ILS/0/SD_ILS:254803
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Author Goldberg, Lee H. Middleton, Wendy.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access Volltext <a href="http://www.sciencedirect.com/science/book/9780750699938">http://www.sciencedirect.com/science/book/9780750699938</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>