Search Results for Safety. - Narrowed by: Optical materials.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dSafety.$0026qf$003dSUBJECT$002509Subject$002509Optical$002bmaterials.$002509Optical$002bmaterials.$0026ic$003dtrue$0026te$003dILS$0026ps$003d300?
2024-09-24T11:12:33Z
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
ent://SD_ILS/0/SD_ILS:168463
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Author Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-85729-236-0">http://dx.doi.org/10.1007/978-0-85729-236-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
ent://SD_ILS/0/SD_ILS:168486
2024-09-24T11:12:33Z
2024-09-24T11:12:33Z
Author Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-85729-310-7">http://dx.doi.org/10.1007/978-0-85729-310-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Reliability of Microtechnology Interconnects, Devices and Systems
ent://SD_ILS/0/SD_ILS:172420
2024-09-24T11:12:33Z
2024-09-24T11:12:33Z
Author Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-5760-3">http://dx.doi.org/10.1007/978-1-4419-5760-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Verformung und Schädigung von Werkstoffen der Aufbau- und Verbindungstechnik Das Verhalten im Mikrobereich
ent://SD_ILS/0/SD_ILS:191278
2024-09-24T11:12:33Z
2024-09-24T11:12:33Z
Author Wiese, Steffen. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-3-642-05463-1">http://dx.doi.org/10.1007/978-3-642-05463-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Solder Joint Reliability Prediction for Multiple Environments
ent://SD_ILS/0/SD_ILS:167673
2024-09-24T11:12:33Z
2024-09-24T11:12:33Z
Author Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-79394-8">http://dx.doi.org/10.1007/978-0-387-79394-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2024-09-24T11:12:33Z
2024-09-24T11:12:33Z
Author Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
A Guide to Lead-free Solders Physical Metallurgy and Reliability
ent://SD_ILS/0/SD_ILS:175373
2024-09-24T11:12:33Z
2024-09-24T11:12:33Z
Author Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-84628-310-9">http://dx.doi.org/10.1007/978-1-84628-310-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Solder Joint Technology Materials, Properties, and Reliability
ent://SD_ILS/0/SD_ILS:166252
2024-09-24T11:12:33Z
2024-09-24T11:12:33Z
Author Tu, King-Ning. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-38892-2">http://dx.doi.org/10.1007/978-0-387-38892-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
ent://SD_ILS/0/SD_ILS:166405
2024-09-24T11:12:33Z
2024-09-24T11:12:33Z
Author Subramanian, K. N. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-48433-4">http://dx.doi.org/10.1007/978-0-387-48433-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Force Sensors for Microelectronic Packaging Applications
ent://SD_ILS/0/SD_ILS:181096
2024-09-24T11:12:33Z
2024-09-24T11:12:33Z
Author Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>