Search Results for Thermal Process Engineering. - Narrowed by: Electronics.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dThermal$002bProcess$002bEngineering.$0026qf$003dSUBJECT$002509Subject$002509Electronics.$002509Electronics.$0026ps$003d300?dt=list2026-06-10T05:56:17ZHybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integrationent://SD_ILS/0/SD_ILS:6085152026-06-10T05:56:17Z2026-06-10T05:56:17ZAuthor Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-96-4166-6">https://doi.org/10.1007/978-981-96-4166-6</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Applications in Electronics and Computing Systems Proceedings of the 4th International Conference on Applications in Electronics and Computing Systems AECS-2022ent://SD_ILS/0/SD_ILS:5285842026-06-10T05:56:17Z2026-06-10T05:56:17ZAuthor Dantsevich, Igor. editor. Samoylenko, Irina. editor. (orcid)0000-0001-6907-1403 SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-031-20631-3">https://doi.org/10.1007/978-3-031-20631-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>