Search Results for Three-dimensional integrated circuits -- Design and construction.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dThree-dimensional$002bintegrated$002bcircuits$002b--$002bDesign$002band$002bconstruction.$0026ps$003d300?
2024-09-12T15:28:12Z
Three-dimensional integrated circuit design
ent://SD_ILS/0/SD_ILS:459630
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Author Pavlidis, Vasilis F., 1976- author. Savidis, Ioannis, author. Frian, Eby G., author.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780124105010">http://www.sciencedirect.com/science/book/9780124105010</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Handbook of 3D Integration : 3D process technology
ent://SD_ILS/0/SD_ILS:342210
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Author Garrou, Philip E., editor. Koyanagi, Mitsumasa, editor. Ramm, Peter, editor.<br/>Preferred Shelf Number ONLINE(342210.1)<br/>Electronic Access John Wiley <a href="http://dx.doi.org/10.1002/9783527670109">http://dx.doi.org/10.1002/9783527670109</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Through-silicon vias for 3D integration
ent://SD_ILS/0/SD_ILS:293478
2024-09-12T15:28:12Z
2024-09-12T15:28:12Z
Author Lau, John.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/throughsilicon-vias-for-3d-integration">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
3D IC stacking technology
ent://SD_ILS/0/SD_ILS:293493
2024-09-12T15:28:12Z
2024-09-12T15:28:12Z
Author Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>