Search Results for Three-dimensional integrated circuits.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dThree-dimensional$002bintegrated$002bcircuits.$0026ic$003dtrue$0026ps$003d300?dt=list2026-01-16T20:41:40Z3D integration of resistive switching memoryent://SD_ILS/0/SD_ILS:5705322026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Luo, Qing, 1988- editor.<br/>Preferred Shelf Number TK7895 .M4 A14 2023<br/>Electronic Access Taylor & Francis <a href="https://www.taylorfrancis.com/books/9781003391586">https://www.taylorfrancis.com/books/9781003391586</a>
OCLC metadata license agreement <a href="http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf">http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Semiconducting black phosphorus : from 2D nanomaterial to emerging 3D architectureent://SD_ILS/0/SD_ILS:5683262026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Zhang, Han (Semiconductor scientist), author. Abbasi, Nasir Mahmood, author. Wang, Bing (Semiconductor scientist), author.<br/>Preferred Shelf Number TK7874.893<br/>Electronic Access Taylor & Francis <a href="https://www.taylorfrancis.com/books/9781003217145">https://www.taylorfrancis.com/books/9781003217145</a>
OCLC metadata license agreement <a href="http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf">http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Three-dimensional integrated circuit designent://SD_ILS/0/SD_ILS:4596302026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Pavlidis, Vasilis F., 1976- author. Savidis, Ioannis, author. Frian, Eby G., author.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780124105010">http://www.sciencedirect.com/science/book/9780124105010</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Design of 3D integrated circuits and systemsent://SD_ILS/0/SD_ILS:5414562026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Sharma, Rohit, editor.<br/>Preferred Shelf Number TK7874.893 .D48 2014<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781466589421">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>Vertical 3D memory technologiesent://SD_ILS/0/SD_ILS:3417302026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Prince, Betty, author.<br/>Preferred Shelf Number ONLINE(341730.1)<br/>Electronic Access ebrary <a href="http://alltitles.ebrary.com/Doc?id=10899788">An electronic book accessible through the World Wide Web; click to view</a>
John Wiley <a href="http://dx.doi.org/10.1002/9781118760475">http://dx.doi.org/10.1002/9781118760475</a>
Safari Books Online <a href="http://proquest.safaribooksonline.com/?fpi=9781118760468">http://proquest.safaribooksonline.com/?fpi=9781118760468</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Handbook of 3D Integration : 3D process technologyent://SD_ILS/0/SD_ILS:3422102026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Garrou, Philip E., editor. Koyanagi, Mitsumasa, editor. Ramm, Peter, editor.<br/>Preferred Shelf Number ONLINE(342210.1)<br/>Electronic Access John Wiley <a href="http://dx.doi.org/10.1002/9783527670109">http://dx.doi.org/10.1002/9783527670109</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMCent://SD_ILS/0/SD_ILS:2493612026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Li, Er-Ping. Wiley InterScience (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access IEEEXplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMCent://SD_ILS/0/SD_ILS:2698672026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Li, Er-Ping.<br/>Preferred Shelf Number TK7874.893 L53 2012<br/>Format: Books<br/>Availability Beytepe Library~1<br/>Through-silicon vias for 3D integrationent://SD_ILS/0/SD_ILS:2934782026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Lau, John.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/throughsilicon-vias-for-3d-integration">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>3D IC stacking technologyent://SD_ILS/0/SD_ILS:2934932026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>Nano and molecular electronics handbookent://SD_ILS/0/SD_ILS:5465022026-01-16T20:41:40Z2026-01-16T20:41:40ZAuthor Lyshevski, Sergey Edward.<br/>Preferred Shelf Number TK7874.8 .N358 2007<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781420008142">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>