Search Results for Wong, C. P. - Narrowed by: Systems engineering.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dWong$00252C$002bC.$002bP.$0026qf$003dSUBJECT$002509Subject$002509Systems$002bengineering.$002509Systems$002bengineering.$0026ic$003dtrue$0026ps$003d300?
2026-01-21T01:26:39Z
Advanced Flip Chip Packaging
ent://SD_ILS/0/SD_ILS:330808
2026-01-21T01:26:39Z
2026-01-21T01:26:39Z
Author Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE(330808.1)<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Electrical Conductive Adhesives with Nanotechnologies
ent://SD_ILS/0/SD_ILS:167909
2026-01-21T01:26:39Z
2026-01-21T01:26:39Z
Author Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-88783-8">http://dx.doi.org/10.1007/978-0-387-88783-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>