Search Results for Wong, C.P. - Narrowed by: Electronics. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dWong$00252C$002bC.P.$0026qf$003dSUBJECT$002509Subject$002509Electronics.$002509Electronics.$0026ic$003dtrue$0026ps$003d300? 2024-10-30T15:22:09Z Nano-Bio- Electronic, Photonic and MEMS Packaging ent://SD_ILS/0/SD_ILS:171848 2024-10-30T15:22:09Z 2024-10-30T15:22:09Z Author&#160;Wong, C.P. editor.&#160;Moon, Kyoung-Sik. editor.&#160;Li, Yi (Grace). editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-0040-1">http://dx.doi.org/10.1007/978-1-4419-0040-1</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:167565 2024-10-30T15:22:09Z 2024-10-30T15:22:09Z Author&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-78219-5">http://dx.doi.org/10.1007/978-0-387-78219-5</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advanced Flip Chip Packaging ent://SD_ILS/0/SD_ILS:330808 2024-10-30T15:22:09Z 2024-10-30T15:22:09Z Author&#160;Tong, Ho-Ming. editor.&#160;Lai, Yi-Shao. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE(330808.1)<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Electrical Conductive Adhesives with Nanotechnologies ent://SD_ILS/0/SD_ILS:167909 2024-10-30T15:22:09Z 2024-10-30T15:22:09Z Author&#160;Li, Yi. author.&#160;Lu, Daniel. author.&#160;Wong, C. P. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-88783-8">http://dx.doi.org/10.1007/978-0-387-88783-8</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ent://SD_ILS/0/SD_ILS:165900 2024-10-30T15:22:09Z 2024-10-30T15:22:09Z Author&#160;Suhir, E. editor.&#160;Lee, Y. C. editor.&#160;Wong, C. P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/>