Search Results for Wong, C.P. - Narrowed by: Engineering.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dWong$00252C$002bC.P.$0026qf$003dSUBJECT$002509Subject$002509Engineering.$002509Engineering.$0026ps$003d300?
2024-11-09T20:21:03Z
Advanced Flip Chip Packaging
ent://SD_ILS/0/SD_ILS:330808
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2024-11-09T20:21:03Z
Author Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE(330808.1)<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Electrical Conductive Adhesives with Nanotechnologies
ent://SD_ILS/0/SD_ILS:167909
2024-11-09T20:21:03Z
2024-11-09T20:21:03Z
Author Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-88783-8">http://dx.doi.org/10.1007/978-0-387-88783-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2024-11-09T20:21:03Z
2024-11-09T20:21:03Z
Author Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>