Search Results for Wong, C.P. - Narrowed by: Materials.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dWong$00252C$002bC.P.$0026qf$003dSUBJECT$002509Subject$002509Materials.$002509Materials.$0026te$003dILS$0026ps$003d300?
2024-10-28T15:52:59Z
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:167565
2024-10-28T15:52:59Z
2024-10-28T15:52:59Z
Author Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-78219-5">http://dx.doi.org/10.1007/978-0-387-78219-5</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Electrical Conductive Adhesives with Nanotechnologies
ent://SD_ILS/0/SD_ILS:167909
2024-10-28T15:52:59Z
2024-10-28T15:52:59Z
Author Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-88783-8">http://dx.doi.org/10.1007/978-0-387-88783-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>