Search Results for Wong, C.P. - Narrowed by: Materials. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dWong$00252C$002bC.P.$0026qf$003dSUBJECT$002509Subject$002509Materials.$002509Materials.$0026te$003dILS$0026ps$003d300?dt=list 2024-12-23T15:47:13Z Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:167565 2024-12-23T15:47:13Z 2024-12-23T15:47:13Z Author&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-78219-5">http://dx.doi.org/10.1007/978-0-387-78219-5</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Electrical Conductive Adhesives with Nanotechnologies ent://SD_ILS/0/SD_ILS:167909 2024-12-23T15:47:13Z 2024-12-23T15:47:13Z Author&#160;Li, Yi. author.&#160;Lu, Daniel. author.&#160;Wong, C. P. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-88783-8">http://dx.doi.org/10.1007/978-0-387-88783-8</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/>