Search Results for packaging. - Narrowed by: SpringerLink (Online service) SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dpackaging.$0026qf$003dAUTHOR$002509Author$002509SpringerLink$002b$002528Online$002bservice$002529$002509SpringerLink$002b$002528Online$002bservice$002529$0026ic$003dtrue$0026ps$003d300?dt=list 2026-06-01T20:41:47Z Packaging for Sustainability ent://SD_ILS/0/SD_ILS:168649 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Verghese, Karli. editor.&#160;Lewis, Helen. editor.&#160;Fitzpatrick, Leanne. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-85729-988-8">http://dx.doi.org/10.1007/978-0-85729-988-8</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Bionanocomposites for Packaging Applications ent://SD_ILS/0/SD_ILS:401242 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Jawaid, Mohammad. editor.&#160;Swain, Sarat Kumar. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-3-319-67319-6">https://doi.org/10.1007/978-3-319-67319-6</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:611028 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:167565 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-78219-5">http://dx.doi.org/10.1007/978-0-387-78219-5</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Fuel Cell Electronics Packaging ent://SD_ILS/0/SD_ILS:166371 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Kuang, Ken. editor.&#160;Easler, Keith. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-47324-6">http://dx.doi.org/10.1007/978-0-387-47324-6</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Nanotechnology in Food Packaging ent://SD_ILS/0/SD_ILS:607661 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Kumar, Awanish. editor. (orcid)0000-0001-8735-479X&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-3-031-82399-2">https://doi.org/10.1007/978-3-031-82399-2</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Environmental Footprints of Packaging ent://SD_ILS/0/SD_ILS:614309 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Muthu, Subramanian Senthilkannan. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-287-913-4">https://doi.org/10.1007/978-981-287-913-4</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advanced Flip Chip Packaging ent://SD_ILS/0/SD_ILS:330808 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Tong, Ho-Ming. editor.&#160;Lai, Yi-Shao. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE(330808.1)<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Packaging for Food Preservation ent://SD_ILS/0/SD_ILS:332324 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Del Nobile, Matteo Alessandro. author.&#160;Conte, Amalia. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE(332324.1)<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4614-7684-9">http://dx.doi.org/10.1007/978-1-4614-7684-9</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Organic-Based Nanomaterials in Food Packaging ent://SD_ILS/0/SD_ILS:603922 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Younis, Kaiser. editor.&#160;Yousuf, Owais. editor. (orcid)0000-0002-9706-3707&#160;Ul Islam, Shahid. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-3-031-63829-9">https://doi.org/10.1007/978-3-031-63829-9</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Innovative Technologies for Printing and Packaging ent://SD_ILS/0/SD_ILS:528505 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Xu, Min. editor.&#160;Yang, Li. editor.&#160;Zhang, Linghao. editor.&#160;Yan, Shu. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-19-9024-3">https://doi.org/10.1007/978-981-19-9024-3</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Chiplet Design and Heterogeneous Integration Packaging ent://SD_ILS/0/SD_ILS:527684 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Lau, John H. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Fan-Out Wafer-Level Packaging ent://SD_ILS/0/SD_ILS:399728 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Lau, John H. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-10-8884-1">https://doi.org/10.1007/978-981-10-8884-1</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> RF and Microwave Microelectronics Packaging II ent://SD_ILS/0/SD_ILS:616783 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Kuang, Ken. editor.&#160;Sturdivant, Rick. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-3-319-51697-4">https://doi.org/10.1007/978-3-319-51697-4</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> RF and Microwave Microelectronics Packaging ent://SD_ILS/0/SD_ILS:172116 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Kuang, Ken. editor.&#160;Kim, Franklin. editor.&#160;Cahill, Sean S. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-0984-8">http://dx.doi.org/10.1007/978-1-4419-0984-8</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Nanopackaging Nanotechnologies and Electronics Packaging ent://SD_ILS/0/SD_ILS:166372 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Morris, James E. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-47325-3">http://dx.doi.org/10.1007/978-0-387-47325-3</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Integrated Circuit Packaging, Assembly and Interconnections ent://SD_ILS/0/SD_ILS:165984 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Greig, William J. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/0-387-33913-2">http://dx.doi.org/10.1007/0-387-33913-2</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Force Sensors for Microelectronic Packaging Applications ent://SD_ILS/0/SD_ILS:181096 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Schwizer, J&uuml;rg. author.&#160;Mayer, Michael. author.&#160;Brand, Oliver. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advances in Printing, Packaging and Communication Technologies ent://SD_ILS/0/SD_ILS:607909 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Song, Huihui. editor.&#160;Xu, Min. editor.&#160;Yang, Li. editor.&#160;Zhang, Linghao. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-96-4467-4">https://doi.org/10.1007/978-981-96-4467-4</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Interconnect Reliability in Advanced Memory Device Packaging ent://SD_ILS/0/SD_ILS:526838 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Gan, Chong Leong,. author.&#160;Huang, Chen-Yu,. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a 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(orcid)0000-0001-9174-0781&#160;Sinha, Saurabh. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-3-030-14690-0">https://doi.org/10.1007/978-3-030-14690-0</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Modeling and Application of Flexible Electronics Packaging ent://SD_ILS/0/SD_ILS:484436 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Huang, YongAn. author.&#160;Yin, Zhouping. author.&#160;Wan, Xiaodong. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-13-3627-0">https://doi.org/10.1007/978-981-13-3627-0</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advanced Graphic Communications, Packaging Technology and Materials ent://SD_ILS/0/SD_ILS:614616 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Ouyang, Yun. editor.&#160;Xu, Min. editor.&#160;Yang, Li. editor.&#160;Ouyang, Yujie. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-10-0072-0">https://doi.org/10.1007/978-981-10-0072-0</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Nano-Bio- Electronic, Photonic and MEMS Packaging ent://SD_ILS/0/SD_ILS:171848 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Wong, C.P. editor.&#160;Moon, Kyoung-Sik. editor.&#160;Li, Yi (Grace). editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-0040-1">http://dx.doi.org/10.1007/978-1-4419-0040-1</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Sustainability in Food Packaging Systems, Actors and Innovation ent://SD_ILS/0/SD_ILS:608633 2026-06-01T20:41:47Z 2026-06-01T20:41:47Z Author&#160;Tynkkynen, Nina. editor. 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