Search Results for packaging. - Narrowed by: Electronic circuits.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dpackaging.$0026qf$003dSUBJECT$002509Subject$002509Electronic$002bcircuits.$002509Electronic$002bcircuits.$0026ps$003d300$0026isd$003dtrue?
2026-05-13T16:47:00Z
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:611028
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Chiplet Design and Heterogeneous Integration Packaging
ent://SD_ILS/0/SD_ILS:527684
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Lau, John H. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
RF and Microwave Microelectronics Packaging II
ent://SD_ILS/0/SD_ILS:616783
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-51697-4">https://doi.org/10.1007/978-3-319-51697-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Interconnect Reliability in Advanced Memory Device Packaging
ent://SD_ILS/0/SD_ILS:526838
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-031-26708-6">https://doi.org/10.1007/978-3-031-26708-6</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
3D Microelectronic Packaging From Fundamentals to Applications
ent://SD_ILS/0/SD_ILS:613043
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-44586-1">https://doi.org/10.1007/978-3-319-44586-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
ent://SD_ILS/0/SD_ILS:529887
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
ent://SD_ILS/0/SD_ILS:530077
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-1-4939-1556-9">https://doi.org/10.1007/978-1-4939-1556-9</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Electronic and photonic circuits and devices
ent://SD_ILS/0/SD_ILS:249690
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Waynant, Ronald W. Lowell, John. IEEE Circuits and Systems Society. Components, Packaging & Manufacturing Technology Society.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access IEEE Xplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263558">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263558</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Nanometer CMOS ICs From Basics to ASICs
ent://SD_ILS/0/SD_ILS:605641
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Veendrick, Harry. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-031-64249-4">https://doi.org/10.1007/978-3-031-64249-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Mapping Innovation The Discipline of Building Opportunity across Value Chains
ent://SD_ILS/0/SD_ILS:526682
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-030-93627-3">https://doi.org/10.1007/978-3-030-93627-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Nanometer CMOS ICs From Basics to ASICs
ent://SD_ILS/0/SD_ILS:613481
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author J.M. Veendrick, Harry. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-47597-4">https://doi.org/10.1007/978-3-319-47597-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Enabling the Internet of Things From Integrated Circuits to Integrated Systems
ent://SD_ILS/0/SD_ILS:616591
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Alioto, Massimo. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-51482-6">https://doi.org/10.1007/978-3-319-51482-6</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Wireless Power Transfer and Data Communication for Neural Implants Case Study: Epilepsy Monitoring
ent://SD_ILS/0/SD_ILS:612392
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Yilmaz, Gürkan. author. Dehollain, Catherine. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-49337-4">https://doi.org/10.1007/978-3-319-49337-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Fundamentals of Electronic Systems Design
ent://SD_ILS/0/SD_ILS:616724
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Lienig, Jens. author. (orcid)0000-0002-2140-4587 Bruemmer, Hans. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-55840-0">https://doi.org/10.1007/978-3-319-55840-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Silicon Nanowire Transistors
ent://SD_ILS/0/SD_ILS:612723
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Bindal, Ahmet. author. Hamedi-Hagh, Sotoudeh. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-27177-4">https://doi.org/10.1007/978-3-319-27177-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
3D Flash Memories
ent://SD_ILS/0/SD_ILS:614981
2026-05-13T16:47:00Z
2026-05-13T16:47:00Z
Author Micheloni, Rino. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-94-017-7512-0">https://doi.org/10.1007/978-94-017-7512-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>