Search Results for packaging. - Narrowed by: Electronics. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dpackaging.$0026qf$003dSUBJECT$002509Subject$002509Electronics.$002509Electronics.$0026ps$003d300$0026isd$003dtrue? 2026-01-21T20:01:46Z Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:167565 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-78219-5">http://dx.doi.org/10.1007/978-0-387-78219-5</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advanced Flip Chip Packaging ent://SD_ILS/0/SD_ILS:330808 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Tong, Ho-Ming. editor.&#160;Lai, Yi-Shao. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE(330808.1)<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Chiplet Design and Heterogeneous Integration Packaging ent://SD_ILS/0/SD_ILS:527684 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Lau, John H. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Polymeric materials for electronic packaging ent://SD_ILS/0/SD_ILS:598478 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Nakamura, Shozo (Professor Emeritus), author.<br/>Preferred Shelf Number&#160;QD382 .C66 N35 2023<br/>Electronic Access&#160;<a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826">https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> RF and Microwave Microelectronics Packaging ent://SD_ILS/0/SD_ILS:172116 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Kuang, Ken. editor.&#160;Kim, Franklin. editor.&#160;Cahill, Sean S. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-0984-8">http://dx.doi.org/10.1007/978-1-4419-0984-8</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Nanopackaging Nanotechnologies and Electronics Packaging ent://SD_ILS/0/SD_ILS:166372 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Morris, James E. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-0-387-47325-3">http://dx.doi.org/10.1007/978-0-387-47325-3</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Integrated Circuit Packaging, Assembly and Interconnections ent://SD_ILS/0/SD_ILS:165984 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Greig, William J. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/0-387-33913-2">http://dx.doi.org/10.1007/0-387-33913-2</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Force Sensors for Microelectronic Packaging Applications ent://SD_ILS/0/SD_ILS:181096 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Schwizer, J&uuml;rg. author.&#160;Mayer, Michael. author.&#160;Brand, Oliver. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Modeling and Application of Flexible Electronics Packaging ent://SD_ILS/0/SD_ILS:484436 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Huang, YongAn. author.&#160;Yin, Zhouping. author.&#160;Wan, Xiaodong. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-981-13-3627-0">https://doi.org/10.1007/978-981-13-3627-0</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Nano-Bio- Electronic, Photonic and MEMS Packaging ent://SD_ILS/0/SD_ILS:171848 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Wong, C.P. editor.&#160;Moon, Kyoung-Sik. editor.&#160;Li, Yi (Grace). editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-0040-1">http://dx.doi.org/10.1007/978-1-4419-0040-1</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advances in embedded and fan-out wafer level packaging technologies ent://SD_ILS/0/SD_ILS:594706 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Keser, Beth, 1971- editor.&#160;Kroehnert, Steffen, 1970- editor.<br/>Preferred Shelf Number&#160;TK7870.17 .A38 2019<br/>Electronic Access&#160;<a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications ent://SD_ILS/0/SD_ILS:530077 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Qu, Shichun. author.&#160;Liu, Yong. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="https://doi.org/10.1007/978-1-4939-1556-9">https://doi.org/10.1007/978-1-4939-1556-9</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Power Electronic Packaging Design, Assembly Process, Reliability and Modeling ent://SD_ILS/0/SD_ILS:173841 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Liu, Yong. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4614-1053-9">http://dx.doi.org/10.1007/978-1-4614-1053-9</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Advanced Materials for Thermal Management of Electronic Packaging ent://SD_ILS/0/SD_ILS:172970 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Tong, Xingcun Colin. author.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/978-1-4419-7759-5">http://dx.doi.org/10.1007/978-1-4419-7759-5</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ent://SD_ILS/0/SD_ILS:165900 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Suhir, E. editor.&#160;Lee, Y. C. editor.&#160;Wong, C. P. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Materials for Information Technology Devices, Interconnects and Packaging ent://SD_ILS/0/SD_ILS:175333 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Zschech, Ehrenfried. editor.&#160;Whelan, Caroline. editor.&#160;Mikolajick, Thomas. editor.&#160;SpringerLink (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://dx.doi.org/10.1007/1-84628-235-7">http://dx.doi.org/10.1007/1-84628-235-7</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Sensing technologies for real time monitoring of water quality ent://SD_ILS/0/SD_ILS:598351 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Manjakkal, Libu, author.&#160;Lorenzelli, Leandro, author.&#160;Willander, M., author.<br/>Preferred Shelf Number&#160;TD367 .M3175 2023<br/>Electronic Access&#160;<a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Substrate-integrated millimeter-wave antennas for next-generation communication and radar systems ent://SD_ILS/0/SD_ILS:596619 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Chen, Zhi Ning, editor.&#160;Qing, Xianming, editor.&#160;John Wiley &amp; Sons, publisher.<br/>Preferred Shelf Number&#160;TK7871.6 .S83 2021<br/>Electronic Access&#160;<a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119611165">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119611165</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> The ESD control program handbook ent://SD_ILS/0/SD_ILS:595961 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Smallwood, J. M. (Jeremy M.), author.<br/>Preferred Shelf Number&#160;TK7870<br/>Electronic Access&#160;<a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781118694541">https://onlinelibrary.wiley.com/doi/book/10.1002/9781118694541</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used ent://SD_ILS/0/SD_ILS:596092 2026-01-21T20:01:46Z 2026-01-21T20:01:46Z Author&#160;Domingo, George, 1937- author.<br/>Preferred Shelf Number&#160;TK7871.85 .D66 2020<br/>Electronic Access&#160;<a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/>