Search Results for packaging. - Narrowed by: Engineering design.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dpackaging.$0026qf$003dSUBJECT$002509Subject$002509Engineering$002bdesign.$002509Engineering$002bdesign.$0026ps$003d300$0026isd$003dtrue?
2026-01-21T20:01:54Z
Packaging for Sustainability
ent://SD_ILS/0/SD_ILS:168649
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Author Verghese, Karli. editor. Lewis, Helen. editor. Fitzpatrick, Leanne. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-85729-988-8">http://dx.doi.org/10.1007/978-0-85729-988-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Integrated Circuit Packaging, Assembly and Interconnections
ent://SD_ILS/0/SD_ILS:165984
2026-01-21T20:01:54Z
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Author Greig, William J. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-33913-2">http://dx.doi.org/10.1007/0-387-33913-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Systems-Level Packaging for Millimeter-Wave Transceivers
ent://SD_ILS/0/SD_ILS:484945
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2026-01-21T20:01:54Z
Author Božanić, Mladen. author. (orcid)0000-0001-9174-0781 Sinha, Saurabh. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-030-14690-0">https://doi.org/10.1007/978-3-030-14690-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2026-01-21T20:01:54Z
2026-01-21T20:01:54Z
Author Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
CAD, 3D Modeling, Engineering Analysis, and Prototype Experimentation Industrial and Research Applications
ent://SD_ILS/0/SD_ILS:529641
2026-01-21T20:01:54Z
2026-01-21T20:01:54Z
Author Zheng Li, Jeremy. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-05921-1">https://doi.org/10.1007/978-3-319-05921-1</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>