Search Results for packaging. - Narrowed by: Microelectronic packaging.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dpackaging.$0026qf$003dSUBJECT$002509Subject$002509Microelectronic$002bpackaging.$002509Microelectronic$002bpackaging.$0026ps$003d300$0026isd$003dtrue?
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Microelectronic packaging
ent://SD_ILS/0/SD_ILS:540537
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Author Datta, Madhav. Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)<br/>Preferred Shelf Number TK7870.15 .M53 2005<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781136942761">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
Advanced electronic packaging
ent://SD_ILS/0/SD_ILS:249765
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Author Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-<br/>Preferred Shelf Number ONLINE<br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Advanced electronic packaging
ent://SD_ILS/0/SD_ILS:249822
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Author Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-<br/>Preferred Shelf Number ONLINE<br/>Electronic Access IEEE Xplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Semiconductor packaging : materials interaction and reliability
ent://SD_ILS/0/SD_ILS:546600
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Author Chen, Andrea., author. Lo, Randy.<br/>Preferred Shelf Number TK7870.15 .C54 2012<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781439862070">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
Introduction to microsystem packaging technology
ent://SD_ILS/0/SD_ILS:546454
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Author Jin, Yufeng., author. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-<br/>Preferred Shelf Number TK7870.15 .J56 2011<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781315217086">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
MEMS/MOEMS packaging concepts, designs, materials, and processes
ent://SD_ILS/0/SD_ILS:293599
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Author Gilleo, Ken.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
ent://SD_ILS/0/SD_ILS:597223
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Author Keser, Beth, 1971- editor. Kröhnert, Steffen, editor.<br/>Preferred Shelf Number TK7870.15 .E43 2021<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119793908">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119793908</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
ent://SD_ILS/0/SD_ILS:460117
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Author Suganuma, Katsuaki, editor.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access ScienceDirect <a href="https://www.sciencedirect.com/science/book/9780081020944">https://www.sciencedirect.com/science/book/9780081020944</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Quantum-well laser array packaging nanoscale packaging techniques
ent://SD_ILS/0/SD_ILS:293590
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Author Tomm, Jens W. Jim�enez, J. (Juan)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/quantumwell-laser-array-packaging">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Antenna-in-package technology and applications
ent://SD_ILS/0/SD_ILS:595805
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Author Liu, Duixian, editor. Zhang, Yueping, editor.<br/>Preferred Shelf Number TK7871.67 .M5 A58 2020<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119556671">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119556671</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
MEMS : fundamental technology and applications
ent://SD_ILS/0/SD_ILS:547455
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Author Choudhary, Vikas. Iniewski, Krzysztof.<br/>Preferred Shelf Number TK7875 .M457 2013<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781315216393">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
3D IC stacking technology
ent://SD_ILS/0/SD_ILS:293493
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Author Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
IC component sockets
ent://SD_ILS/0/SD_ILS:301581
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Author Liu, Weifeng. Pecht, Michael. John Wiley & Sons.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access John Wiley <a href="http://dx.doi.org/10.1002/0471648272">http://dx.doi.org/10.1002/0471648272</a>
Contributor biographical information <a href="http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html">http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>