Search Results for packaging. - Narrowed by: Surfaces (Physics).

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

2026-06-16T02:46:44Z

Author Seok, Seonho. author. SpringerLink (Online service)
Preferred Shelf Number ONLINE
Electronic Access https://doi.org/10.1007/978-3-319-77872-3
Format: Electronic Resources
Availability Online Library~1

Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging

2026-06-16T02:46:44Z

Author Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)
Preferred Shelf Number ONLINE
Electronic Access http://dx.doi.org/10.1007/978-3-642-28522-6
Format: Electronic Resources
Availability Online Library~1

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

2026-06-16T02:46:44Z

Author Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number ONLINE
Electronic Access http://dx.doi.org/10.1007/0-387-32989-7
Format: Electronic Resources
Availability Online Library~1

Materials for Information Technology Devices, Interconnects and Packaging

2026-06-16T02:46:44Z

Author Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
Preferred Shelf Number ONLINE
Electronic Access http://dx.doi.org/10.1007/1-84628-235-7
Format: Electronic Resources
Availability Online Library~1