Search Results for packaging. - Narrowed by: Three-dimensional integrated circuits. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dpackaging.$0026qf$003dSUBJECT$002509Subject$002509Three-dimensional$002bintegrated$002bcircuits.$002509Three-dimensional$002bintegrated$002bcircuits.$0026ic$003dtrue$0026ps$003d300? 2026-01-21T14:23:49Z Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC ent://SD_ILS/0/SD_ILS:249361 2026-01-21T14:23:49Z 2026-01-21T14:23:49Z Author&#160;Li, Er-Ping.&#160;Wiley InterScience (Online service)<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;IEEEXplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/> Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC ent://SD_ILS/0/SD_ILS:269867 2026-01-21T14:23:49Z 2026-01-21T14:23:49Z Author&#160;Li, Er-Ping.<br/>Preferred Shelf Number&#160;TK7874.893 L53 2012<br/>Format:&#160;Books<br/>Availability&#160;Beytepe Library~1<br/> 3D IC stacking technology ent://SD_ILS/0/SD_ILS:293493 2026-01-21T14:23:49Z 2026-01-21T14:23:49Z Author&#160;Wu, Banqiu.&#160;Kumar, Ajay.&#160;Ramaswami, Sesh.<br/>Preferred Shelf Number&#160;ONLINE<br/>Electronic Access&#160;<a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format:&#160;Electronic Resources<br/>Availability&#160;Online Library~1<br/>