Search Results for solder.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/en_US/default/default/qu$003dsolder.$0026ic$003dtrue$0026te$003dILS$0026ps$003d300?dt=list
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Lead Free Solder Mechanics and Reliability
ent://SD_ILS/0/SD_ILS:173692
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Author Pang, John Hock Lye. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-1-4614-0463-7">http://dx.doi.org/10.1007/978-1-4614-0463-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Lead-free solder process development
ent://SD_ILS/0/SD_ILS:249901
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Author Bath, Jasbir. Henshall, Gregory Arthur. Handwerker, Carol A.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access IEEE Xplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5732782">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5732782</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Solder Joint Reliability Prediction for Multiple Environments
ent://SD_ILS/0/SD_ILS:167673
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Author Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-79394-8">http://dx.doi.org/10.1007/978-0-387-79394-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Solder Joint Technology Materials, Properties, and Reliability
ent://SD_ILS/0/SD_ILS:166252
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Author Tu, King-Ning. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-387-38892-2">http://dx.doi.org/10.1007/978-0-387-38892-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Avoiding inelastic strains in solder joint interconnections of IC devices
ent://SD_ILS/0/SD_ILS:590345
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Author Suhir, Ephraim, author.<br/>Preferred Shelf Number TK7874.53 .S84 2021 EB<br/>Electronic Access Taylor & Francis <a href="https://www.taylorfrancis.com/books/9780429460470">https://www.taylorfrancis.com/books/9780429460470</a>
OCLC metadata license agreement <a href="http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf">http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
ent://SD_ILS/0/SD_ILS:615603
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Author Zhang, Qingke. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-662-48823-2">https://doi.org/10.1007/978-3-662-48823-2</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
ent://SD_ILS/0/SD_ILS:530321
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Author Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-1-4614-9266-5">https://doi.org/10.1007/978-1-4614-9266-5</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Solder Joint Reliability Assessment Finite Element Simulation Methodology
ent://SD_ILS/0/SD_ILS:530730
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Author Tamin, Mohd N. author. Shaffiar, Norhashimah M. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-00092-3">https://doi.org/10.1007/978-3-319-00092-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
ent://SD_ILS/0/SD_ILS:168463
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Author Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://dx.doi.org/10.1007/978-0-85729-236-0">http://dx.doi.org/10.1007/978-0-85729-236-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Handbook of lead-free solder technology for microelectronic assemblies
ent://SD_ILS/0/SD_ILS:547812
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Author Puttlitz, Karl J. Stalter, Kathleen A.<br/>Preferred Shelf Number TK7870.15 .H3657 2004<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781135536855">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
Advances in Acoustics and Vibration IV Proceedings of the Fourth International Conference on Acoustics and Vibration (ICAV2022), December 19-21, 2022, Sousse, Tunisia
ent://SD_ILS/0/SD_ILS:527911
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Author Akrout, Ali. editor. Abdennadher, Moez. editor. Feki, Nabih. editor. Abbes, Mohamed Slim. editor. Chaari, Fakher. editor.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-031-34190-8">https://doi.org/10.1007/978-3-031-34190-8</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Metal Micro-Droplet Based 3D Printing Technology
ent://SD_ILS/0/SD_ILS:526963
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Author Qi, Lehua. author. Luo, Jun. author. Shen, He. author. Lian, Hongcheng. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-99-0965-0">https://doi.org/10.1007/978-981-99-0965-0</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Interconnect Reliability in Advanced Memory Device Packaging
ent://SD_ILS/0/SD_ILS:526838
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Author Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-031-26708-6">https://doi.org/10.1007/978-3-031-26708-6</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Proceedings of the 7th International Corrosion Prevention Symposium for Research Scholars CORSYM 2021, November 2021
ent://SD_ILS/0/SD_ILS:528272
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Author Jalar, Azman. editor. Embong, Zaidi. editor. Othman, Norinsan Kamil. editor. Yaakob, Najmiddin. editor. Bakar, Maria Abu. editor.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-981-19-1851-3">https://doi.org/10.1007/978-981-19-1851-3</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Electronic packaging science and technology
ent://SD_ILS/0/SD_ILS:597053
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Author Tu, K. N. (King-Ning), 1937- author. Chen, Chih, 1970- author. Chen, Hung-Ming, author.<br/>Preferred Shelf Number TK7870.15 .T85 2022<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Design for excellence in electronics manufacturing
ent://SD_ILS/0/SD_ILS:596229
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Author Tulkoff, Cheryl, author. Caswell, Greg, author.<br/>Preferred Shelf Number TK7870 .T845 2021<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119109402">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119109402</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Lead-free soldering process development and reliability
ent://SD_ILS/0/SD_ILS:595935
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Author Bath, Jasbir, editor.<br/>Preferred Shelf Number TK7870.15 .L434 2020<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Harsh environment electronics : interconnect materials and performance assessment
ent://SD_ILS/0/SD_ILS:595195
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Author Sharif, Ahmed, editor.<br/>Preferred Shelf Number TK7871<br/>Electronic Access <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9783527813964">https://onlinelibrary.wiley.com/doi/book/10.1002/9783527813964</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Handbook of Manufacturing Engineering and Technology
ent://SD_ILS/0/SD_ILS:529574
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Author Nee, Andrew Y. C. editor. SpringerLink (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-1-4471-4670-4">https://doi.org/10.1007/978-1-4471-4670-4</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Challenges in Mechanics of Time-Dependent Materials, Volume 2 Proceedings of the 2014 Annual Conference on Experimental and Applied Mechanics
ent://SD_ILS/0/SD_ILS:530441
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Author Qi, H. Jerry. editor. Antoun, Bonnie. editor. Hall, Richard. editor. Lu, Hongbing. editor. Arzoumanidis, Alex. editor.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="https://doi.org/10.1007/978-3-319-06980-7">https://doi.org/10.1007/978-3-319-06980-7</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Green electronics manufacturing : creating environmental sensible products
ent://SD_ILS/0/SD_ILS:546751
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Author Wang, John X., 1962, author.<br/>Preferred Shelf Number TK7836 .W36 2013<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781439826690">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
Lead-free solders materials reliability for electronics
ent://SD_ILS/0/SD_ILS:305591
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Author Subramaniam, K. N., Ph. D. Wiley InterScience (Online service)<br/>Preferred Shelf Number ONLINE<br/>Electronic Access Wiley InterScience <a href="http://dx.doi.org/10.1002/9781119966203">An electronic book accessible through the World Wide Web; click for information</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Welding licensing exam study guide
ent://SD_ILS/0/SD_ILS:293179
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Author Miller, Rex, 1929- Miller, Mark R.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access <a href="http://mhebooklibrary.com/reader/welding-licensing-exam-study-guide">Subscription required</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Electrically conductive adhesives
ent://SD_ILS/0/SD_ILS:544684
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Author Gomatam, R. (Rajesh) Mittal, K. L., 1945-<br/>Preferred Shelf Number TP968 .E42 2008<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9789004187825">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
Lead-free electronics iNEMI projects lead to successful manufacturing
ent://SD_ILS/0/SD_ILS:249521
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Author Bradley, Edwin.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access IEEE Xplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5201530">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5201530</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Lead-free soldering in electronics : science, technology and environmental impact
ent://SD_ILS/0/SD_ILS:544293
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Author Suganuma, Katsuaki.<br/>Preferred Shelf Number TK7870.15 .L43 2004<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781135521318">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
Handbook of Moire measurement
ent://SD_ILS/0/SD_ILS:546035
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Author Walker, C. A. (Colin A.)<br/>Preferred Shelf Number QC415 .H27 2004<br/>Electronic Access <a href="https://www.taylorfrancis.com/books/9781420034219">Click here to view.</a><br/>Format: Books<br/>Availability Online Library~1<br/>
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
ent://SD_ILS/0/SD_ILS:256308
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Author Lee, Ning-Cheng.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access Volltext <a href="http://www.sciencedirect.com/science/book/9780750672184">http://www.sciencedirect.com/science/book/9780750672184</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>
Soldering in electronics assembly
ent://SD_ILS/0/SD_ILS:254609
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Author Judd, Mike. Brindley, Keith.<br/>Preferred Shelf Number ONLINE<br/>Electronic Access ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780750635455">http://www.sciencedirect.com/science/book/9780750635455</a><br/>Format: Electronic Resources<br/>Availability Online Library~1<br/>