Arama Sonuçları Adhesion. - Daraltılmış: 2018SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dAdhesion.$0026qf$003dPUBDATE$002509Yay$0025C4$0025B1n$002bY$0025C4$0025B1l$0025C4$0025B1$0025092018$0025092018$0026ps$003d300?2024-12-01T19:41:56ZHandbook of Adhesion Technologyent://SD_ILS/0/SD_ILS:4002822024-12-01T19:41:56Z2024-12-01T19:41:56ZYazar da Silva, Lucas F. M. editor. Öchsner, Andreas. editor. Adams, Robert D. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-319-55411-2">https://doi.org/10.1007/978-3-319-55411-2</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Adhesion aspects of thin filmsent://SD_ILS/0/SD_ILS:2853782024-12-01T19:41:56Z2024-12-01T19:41:56ZYazar International Symposium on Adhesion Aspects of Thin Films. MST Conferences (Firm)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9789047415213">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Polymer surface modification relevance to adhesionent://SD_ILS/0/SD_ILS:2900342024-12-01T19:41:56Z2024-12-01T19:41:56ZYazar International Symposium on Polymer Surface Modification: Relevance to Adhesion. Mittal, K. L., 1945-<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9789047414162">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Polymer surface modification relevance to adhesionent://SD_ILS/0/SD_ILS:2900352024-12-01T19:41:56Z2024-12-01T19:41:56ZYazar International Symposium on Polymer Surface Modification: Relevance to Adhesion. Mittal, K. L., 1945-<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9789047420057">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Methodent://SD_ILS/0/SD_ILS:4009412024-12-01T19:41:56Z2024-12-01T19:41:56ZYazar Seok, Seonho. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-319-77872-3">https://doi.org/10.1007/978-3-319-77872-3</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>