Arama Sonuçları Aerospace engineering - Daraltılmış: Electronic packaging.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dAerospace$002bengineering$0026qf$003dSUBJECT$002509Konu$002509Electronic$002bpackaging.$002509Electronic$002bpackaging.$0026ic$003dtrue$0026ps$003d300?
2026-01-21T16:14:44Z
Thermal and structural electronic packaging analysis for space and extreme environments
ent://SD_ILS/0/SD_ILS:579090
2026-01-21T16:14:44Z
2026-01-21T16:14:44Z
Yazar Cepeda-Rizo, Juan, author. Gayle, Jeremiah, author. Ravich, Joshua, author.<br/>Yer Numarası TK7870.15<br/>Elektronik Erişim Taylor & Francis <a href="https://www.taylorfrancis.com/books/9781003247005">https://www.taylorfrancis.com/books/9781003247005</a>
OCLC metadata license agreement <a href="http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf">http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
MEMS Packaging
ent://SD_ILS/0/SD_ILS:247779
2026-01-21T16:14:44Z
2026-01-21T16:14:44Z
Yazar Tai-Ran Hsu, ed.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1049/PBEP003E">http://dx.doi.org/10.1049/PBEP003E</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>