Arama Sonuçları Bonding. - Daraltılmış: Microtechnology.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dBonding.$0026qf$003dSUBJECT$002509Konu$002509Microtechnology.$002509Microtechnology.$0026ps$003d300?dt=list
2026-03-21T15:19:18Z
Microactuators, Microsensors and Micromechanisms MAMM 2024
ent://SD_ILS/0/SD_ILS:607579
2026-03-21T15:19:18Z
2026-03-21T15:19:18Z
Yazar Nguyen, Duc-Nam. editor. Tran, Ngoc Dang Khoa. editor. (orcid)0000-0002-5779-2016 Huynh, Van Tuan. editor. Ono, Takahito. editor. Nguyen, Van Hieu. editor.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-031-83357-1">https://doi.org/10.1007/978-3-031-83357-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Chiplet Design and Heterogeneous Integration Packaging
ent://SD_ILS/0/SD_ILS:527684
2026-03-21T15:19:18Z
2026-03-21T15:19:18Z
Yazar Lau, John H. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:611028
2026-03-21T15:19:18Z
2026-03-21T15:19:18Z
Yazar Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
3D Microelectronic Packaging From Fundamentals to Applications
ent://SD_ILS/0/SD_ILS:613043
2026-03-21T15:19:18Z
2026-03-21T15:19:18Z
Yazar Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-319-44586-1">https://doi.org/10.1007/978-3-319-44586-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
ent://SD_ILS/0/SD_ILS:529887
2026-03-21T15:19:18Z
2026-03-21T15:19:18Z
Yazar Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Micro and Nano Fabrication Tools and Processes
ent://SD_ILS/0/SD_ILS:530075
2026-03-21T15:19:18Z
2026-03-21T15:19:18Z
Yazar Gatzen, Hans H. author. Saile, Volker. author. Leuthold, Jürg. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-662-44395-8">https://doi.org/10.1007/978-3-662-44395-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>