Arama Sonuçları Bonding. - Daraltılmış: Microtechnology.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dBonding.$0026qf$003dSUBJECT$002509Konu$002509Microtechnology.$002509Microtechnology.$0026te$003dILS$0026ps$003d300?
2026-03-07T11:20:04Z
Chiplet Design and Heterogeneous Integration Packaging
ent://SD_ILS/0/SD_ILS:527684
2026-03-07T11:20:04Z
2026-03-07T11:20:04Z
Yazar Lau, John H. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
ent://SD_ILS/0/SD_ILS:529887
2026-03-07T11:20:04Z
2026-03-07T11:20:04Z
Yazar Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Micro and Nano Fabrication Tools and Processes
ent://SD_ILS/0/SD_ILS:530075
2026-03-07T11:20:04Z
2026-03-07T11:20:04Z
Yazar Gatzen, Hans H. author. Saile, Volker. author. Leuthold, Jürg. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-662-44395-8">https://doi.org/10.1007/978-3-662-44395-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>