Arama Sonuçları Bonding. - Daraltılmış: Solids.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dBonding.$0026qf$003dSUBJECT$002509Konu$002509Solids.$002509Solids.$0026ic$003dtrue$0026ps$003d300$0026isd$003dtrue?dt=list
2026-01-17T17:33:57Z
Interatomic bonding in solids fundamentals, simulation, applications
ent://SD_ILS/0/SD_ILS:342212
2026-01-17T17:33:57Z
2026-01-17T17:33:57Z
Yazar Levitin, Valim.<br/>Yer Numarası ONLINE(342212.1)<br/>Elektronik Erişim John Wiley <a href="http://dx.doi.org/10.1002/9783527671557">http://dx.doi.org/10.1002/9783527671557</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
2nd International Conference on Industrial Applications of Adhesives 2022 Selected Contributions of IAA 2022
ent://SD_ILS/0/SD_ILS:528778
2026-01-17T17:33:57Z
2026-01-17T17:33:57Z
Yazar da Silva, Lucas F. M. editor. Adams, Robert D. editor. Dilger, Klaus. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-031-11150-1">https://doi.org/10.1007/978-3-031-11150-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Technological Aspects of Manufacturing and Numerical Modelling of Clinch-Adhesive Joints
ent://SD_ILS/0/SD_ILS:529149
2026-01-17T17:33:57Z
2026-01-17T17:33:57Z
Yazar Sadowski, Tomasz. author. Balawender, Tadeusz. author. Golewski, Przemysław. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-319-14902-8">https://doi.org/10.1007/978-3-319-14902-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>