Arama Sonuçları Bonding. - Daraltılmış: Optics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dBonding.$0026qf$003dSUBJECT$002509Subject$002509Optics.$002509Optics.$0026ic$003dtrue$0026ps$003d300?dt=list
2026-03-22T23:16:10Z
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
ent://SD_ILS/0/SD_ILS:603646
2026-03-22T23:16:10Z
2026-03-22T23:16:10Z
Yazar Lau, John H. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-97-2140-5">https://doi.org/10.1007/978-981-97-2140-5</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
LED packaging technologies : design, manufacture, and applications
ent://SD_ILS/0/SD_ILS:598468
2026-03-22T23:16:10Z
2026-03-22T23:16:10Z
Yazar Annaniah, Luruthudass, author Saheed, Mohamed Salleh M., author. Jose, Rajan, author.<br/>Yer Numarası TK7871.89 .L53 A56 2023<br/>Elektronik Erişim <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9783527831678">https://onlinelibrary.wiley.com/doi/book/10.1002/9783527831678</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>