Arama Sonu&ccedil;lar&#305; Chip scale packaging. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dChip$002bscale$002bpackaging.$0026ps$003d300?dt=list 2026-01-14T04:20:17Z Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications ent://SD_ILS/0/SD_ILS:530077 2026-01-14T04:20:17Z 2026-01-14T04:20:17Z Yazar&#160;Qu, Shichun. author.&#160;Liu, Yong. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-1-4939-1556-9">https://doi.org/10.1007/978-1-4939-1556-9</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> MEMS/MOEMS packaging concepts, designs, materials, and processes ent://SD_ILS/0/SD_ILS:293599 2026-01-14T04:20:17Z 2026-01-14T04:20:17Z Yazar&#160;Gilleo, Ken.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Microwave Field-Effect Transistors Theory, design and applications ent://SD_ILS/0/SD_ILS:248009 2026-01-14T04:20:17Z 2026-01-14T04:20:17Z Yazar&#160;Pengelly, Raymond S.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1049/SBEW016E">http://dx.doi.org/10.1049/SBEW016E</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>