Arama Sonuçları Chip scale packaging.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dChip$002bscale$002bpackaging.$0026ps$003d300?dt=list
2026-03-23T20:34:58Z
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
ent://SD_ILS/0/SD_ILS:530077
2026-03-23T20:34:58Z
2026-03-23T20:34:58Z
Yazar Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-1-4939-1556-9">https://doi.org/10.1007/978-1-4939-1556-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
From LED to solid state lighting : principles, materials, packaging, characterization, and applications
ent://SD_ILS/0/SD_ILS:596576
2026-03-23T20:34:58Z
2026-03-23T20:34:58Z
Yazar Lee, Shi-Wei Ricky, author. Lo, Jeffery C. C., author. Tao, Mian, author. Ye, Huaiyu, author.<br/>Yer Numarası TK7871.89 .L53 L4365 2021<br/>Elektronik Erişim <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781118881620">https://onlinelibrary.wiley.com/doi/book/10.1002/9781118881620</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advances in embedded and fan-out wafer level packaging technologies
ent://SD_ILS/0/SD_ILS:594706
2026-03-23T20:34:58Z
2026-03-23T20:34:58Z
Yazar Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.<br/>Yer Numarası TK7870.17 .A38 2019<br/>Elektronik Erişim <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Materials for Advanced Packaging
ent://SD_ILS/0/SD_ILS:611028
2026-03-23T20:34:58Z
2026-03-23T20:34:58Z
Yazar Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
MEMS/MOEMS packaging concepts, designs, materials, and processes
ent://SD_ILS/0/SD_ILS:293599
2026-03-23T20:34:58Z
2026-03-23T20:34:58Z
Yazar Gilleo, Ken.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Microwave Field-Effect Transistors Theory, design and applications
ent://SD_ILS/0/SD_ILS:248009
2026-03-23T20:34:58Z
2026-03-23T20:34:58Z
Yazar Pengelly, Raymond S.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1049/SBEW016E">http://dx.doi.org/10.1049/SBEW016E</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>