Arama Sonu&ccedil;lar&#305; Chip scale packaging. - Daralt&#305;lm&#305;&#351;: Microelectromechanical systems. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dChip$002bscale$002bpackaging.$0026qf$003dSUBJECT$002509Konu$002509Microelectromechanical$002bsystems.$002509Microelectromechanical$002bsystems.$0026ic$003dtrue$0026ps$003d300?dt=list 2026-03-23T15:09:14Z Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:611028 2026-03-23T15:09:14Z 2026-03-23T15:09:14Z Yazar&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> MEMS/MOEMS packaging concepts, designs, materials, and processes ent://SD_ILS/0/SD_ILS:293599 2026-03-23T15:09:14Z 2026-03-23T15:09:14Z Yazar&#160;Gilleo, Ken.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>