Arama Sonu&ccedil;lar&#305; Electric engineering - Daralt&#305;lm&#305;&#351;: Process Engineering. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dElectric$002bengineering$0026qf$003dSUBJECT$002509Konu$002509Process$002bEngineering.$002509Process$002bEngineering.$0026ic$003dtrue$0026ps$003d300$0026isd$003dtrue?dt=list 2026-03-13T23:21:15Z Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration ent://SD_ILS/0/SD_ILS:608515 2026-03-13T23:21:15Z 2026-03-13T23:21:15Z Yazar&#160;Lau, John. author.&#160;Fan, Xuejun. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-981-96-4166-6">https://doi.org/10.1007/978-981-96-4166-6</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Proceedings of the 4th Annual International Conference on Material, Machines, and Methods for Sustainable Development (MMMS2024) Volume 1: Advanced Materials and Manufacturing Technologies ent://SD_ILS/0/SD_ILS:609609 2026-03-13T23:21:15Z 2026-03-13T23:21:15Z Yazar&#160;Long, Banh Tien. editor.&#160;Nang, Ho Xuan. editor.&#160;Huy, Pham Thanh. editor.&#160;Kim, Yun-Hae. editor.&#160;Ishizaki, Kozo. editor.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-031-93816-0">https://doi.org/10.1007/978-3-031-93816-0</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>