Arama Sonuçları Electronic Packaging - Daraltılmış: Engineering.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dElectronic$002bPackaging$0026qf$003dSUBJECT$002509Konu$002509Engineering.$002509Engineering.$0026ic$003dtrue$0026ps$003d300?dt=list
2025-12-06T19:59:48Z
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
ent://SD_ILS/0/SD_ILS:173841
2025-12-06T19:59:48Z
2025-12-06T19:59:48Z
Yazar Liu, Yong. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4614-1053-9">http://dx.doi.org/10.1007/978-1-4614-1053-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advanced Materials for Thermal Management of Electronic Packaging
ent://SD_ILS/0/SD_ILS:172970
2025-12-06T19:59:48Z
2025-12-06T19:59:48Z
Yazar Tong, Xingcun Colin. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-7759-5">http://dx.doi.org/10.1007/978-1-4419-7759-5</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2025-12-06T19:59:48Z
2025-12-06T19:59:48Z
Yazar Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>