Arama Sonuçları Electronic packaging -- Materials.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dElectronic$002bpackaging$002b--$002bMaterials.$0026ic$003dtrue$0026te$003dILS$0026ps$003d300?dt=list2024-12-26T22:22:45ZAdvanced Materials for Thermal Management of Electronic Packagingent://SD_ILS/0/SD_ILS:1729702024-12-26T22:22:45Z2024-12-26T22:22:45ZYazar Tong, Xingcun Colin. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-7759-5">http://dx.doi.org/10.1007/978-1-4419-7759-5</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packagingent://SD_ILS/0/SD_ILS:1659002024-12-26T22:22:45Z2024-12-26T22:22:45ZYazar Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packagingent://SD_ILS/0/SD_ILS:1104482024-12-26T22:22:45Z2024-12-26T22:22:45ZYazar Suhir, Ephraim. Lee, Y. C. Wong, C. P.<br/>Yer Numarası TK7874 .M438 2007 V.1<br/>Format: Kitap<br/>Durum Beytepe Kütüphanesi~2<br/>Ceramic interconnect technology handbookent://SD_ILS/0/SD_ILS:2885002024-12-26T22:22:45Z2024-12-26T22:22:45ZYazar Barlow, Fred D. Elshabini, Aicha.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9781420018967">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>