Arama Sonu&ccedil;lar&#305; Electronic packaging. - Daralt&#305;lm&#305;&#351;: 2007 SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dElectronic$002bpackaging.$0026qf$003dPUBDATE$002509Yay$0025C4$0025B1n$002bY$0025C4$0025B1l$0025C4$0025B1$0025092007$0025092007$0026te$003dILS$0026ps$003d300?dt=list 2024-12-25T21:47:48Z Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging ent://SD_ILS/0/SD_ILS:110448 2024-12-25T21:47:48Z 2024-12-25T21:47:48Z Yazar&#160;Suhir, Ephraim.&#160;Lee, Y. C.&#160;Wong, C. P.<br/>Yer Numaras&#305;&#160;TK7874 .M438 2007 V.1<br/>Format:&#160;Kitap<br/>Durum&#160;Beytepe K&uuml;t&uuml;phanesi~2<br/> Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ent://SD_ILS/0/SD_ILS:165900 2024-12-25T21:47:48Z 2024-12-25T21:47:48Z Yazar&#160;Suhir, E. editor.&#160;Lee, Y. C. editor.&#160;Wong, C. P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Ceramic interconnect technology handbook ent://SD_ILS/0/SD_ILS:288500 2024-12-25T21:47:48Z 2024-12-25T21:47:48Z Yazar&#160;Barlow, Fred D.&#160;Elshabini, Aicha.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://marc.crcnetbase.com/isbn/9781420018967">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>