Arama Sonuçları Electronic packaging. - Daraltılmış: Electronics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dElectronic$002bpackaging.$0026qf$003dSUBJECT$002509Konu$002509Electronics.$002509Electronics.$0026ic$003dtrue$0026ps$003d300?
2026-01-20T23:35:59Z
Polymeric materials for electronic packaging
ent://SD_ILS/0/SD_ILS:598478
2026-01-20T23:35:59Z
2026-01-20T23:35:59Z
Yazar Nakamura, Shozo (Professor Emeritus), author.<br/>Yer Numarası QD382 .C66 N35 2023<br/>Elektronik Erişim <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826">https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Nano-Bio- Electronic, Photonic and MEMS Packaging
ent://SD_ILS/0/SD_ILS:171848
2026-01-20T23:35:59Z
2026-01-20T23:35:59Z
Yazar Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-0040-1">http://dx.doi.org/10.1007/978-1-4419-0040-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
ent://SD_ILS/0/SD_ILS:173841
2026-01-20T23:35:59Z
2026-01-20T23:35:59Z
Yazar Liu, Yong. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4614-1053-9">http://dx.doi.org/10.1007/978-1-4614-1053-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advanced Materials for Thermal Management of Electronic Packaging
ent://SD_ILS/0/SD_ILS:172970
2026-01-20T23:35:59Z
2026-01-20T23:35:59Z
Yazar Tong, Xingcun Colin. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4419-7759-5">http://dx.doi.org/10.1007/978-1-4419-7759-5</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
ent://SD_ILS/0/SD_ILS:165900
2026-01-20T23:35:59Z
2026-01-20T23:35:59Z
Yazar Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Sensing technologies for real time monitoring of water quality
ent://SD_ILS/0/SD_ILS:598351
2026-01-20T23:35:59Z
2026-01-20T23:35:59Z
Yazar Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.<br/>Yer Numarası TD367 .M3175 2023<br/>Elektronik Erişim <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
ent://SD_ILS/0/SD_ILS:596092
2026-01-20T23:35:59Z
2026-01-20T23:35:59Z
Yazar Domingo, George, 1937- author.<br/>Yer Numarası TK7871.85 .D66 2020<br/>Elektronik Erişim <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advances in embedded and fan-out wafer level packaging technologies
ent://SD_ILS/0/SD_ILS:594706
2026-01-20T23:35:59Z
2026-01-20T23:35:59Z
Yazar Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.<br/>Yer Numarası TK7870.17 .A38 2019<br/>Elektronik Erişim <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>