Arama Sonu&ccedil;lar&#305; Electronic packaging. - Daralt&#305;lm&#305;&#351;: Microtechnology. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dElectronic$002bpackaging.$0026qf$003dSUBJECT$002509Subject$002509Microtechnology.$002509Microtechnology.$0026ps$003d300?dt=list 2026-03-21T09:38:09Z Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:611028 2026-03-21T09:38:09Z 2026-03-21T09:38:09Z Yazar&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> 3D Microelectronic Packaging From Fundamentals to Applications ent://SD_ILS/0/SD_ILS:613043 2026-03-21T09:38:09Z 2026-03-21T09:38:09Z Yazar&#160;Li, Yan. editor.&#160;Goyal, Deepak. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-44586-1">https://doi.org/10.1007/978-3-319-44586-1</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>