Arama Sonuçları Grinding and polishing. - Daraltılmış: EnglishSirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dGrinding$002band$002bpolishing.$0026qf$003dLANGUAGE$002509Dil$002509ENG$002509English$0026ps$003d300?2024-11-11T06:21:48ZHandbook of ceramics grinding and polishingent://SD_ILS/0/SD_ILS:3553222024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Marinescu, Ioan D., editor. Doi, Toshiro K., 1947- editor. Uhlmann, Eckart, editor.<br/>Yer Numarası ONLINE(355322.1)<br/>Elektronik Erişim ScienceDirect <a href="http://www.sciencedirect.com/science/book/9781455778584">http://www.sciencedirect.com/science/book/9781455778584</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Handbook of ceramic grinding and polishingent://SD_ILS/0/SD_ILS:2564592024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Marinescu, Ioan D. Tönshoff, H. K. (Hans Kurt) Inasaki, Ichiro.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780815514244">http://www.sciencedirect.com/science/book/9780815514244</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Intelligent Robotics and Applications 16th International Conference, ICIRA 2023, Hangzhou, China, July 5-7, 2023, Proceedings, Part Vent://SD_ILS/0/SD_ILS:5212472024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Yang, Huayong. editor. Liu, Honghai. editor. Zou, Jun. editor. Yin, Zhouping. editor. Liu, Lianqing. editor. (orcid)<br/>Yer Numarası XX(521247.1)<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-99-6495-6">https://doi.org/10.1007/978-981-99-6495-6</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Intelligent Robotics and Applications 16th International Conference, ICIRA 2023, Hangzhou, China, July 5-7, 2023, Proceedings, Part VIent://SD_ILS/0/SD_ILS:5212182024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Yang, Huayong. editor. Liu, Honghai. editor. Zou, Jun. editor. Yin, Zhouping. editor. Liu, Lianqing. editor. (orcid)<br/>Yer Numarası XX(521218.1)<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-99-6480-2">https://doi.org/10.1007/978-981-99-6480-2</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Principles of modern grinding technologyent://SD_ILS/0/SD_ILS:3561282024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Rowe, W. Brian.<br/>Yer Numarası ONLINE(356128.1)<br/>Elektronik Erişim ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780323242714">http://www.sciencedirect.com/science/book/9780323242714</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Tribology of abrasive machining processesent://SD_ILS/0/SD_ILS:1469242024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Marinescu, Ioan D.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim ScienceDirect <a href="http://www.sciencedirect.com/science/book/9781437734676">http://www.sciencedirect.com/science/book/9781437734676</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Advances in CMP/polishing technologies for the manufacture of electronic devicesent://SD_ILS/0/SD_ILS:1461062024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Doi, Toshiro. Marinescu, Ioan D. Kurokawa, Syuhei.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim ScienceDirect <a href="http://www.sciencedirect.com/science/book/9781437778595">http://www.sciencedirect.com/science/book/9781437778595</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Modern grinding techniquesent://SD_ILS/0/SD_ILS:2984802024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Rowe, W. B. (William Brian) Wiley InterScience (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim John Wiley <a href="http://dx.doi.org/10.1002/9780470882313">http://dx.doi.org/10.1002/9780470882313</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Principles of modern grinding technologyent://SD_ILS/0/SD_ILS:1473052024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Rowe, W. B. (William Brian)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780815520184">http://www.sciencedirect.com/science/book/9780815520184</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Handbook of machining with grinding wheelsent://SD_ILS/0/SD_ILS:2893822024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Marinescu, Ioan D.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9781420017649">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Handbook of lapping and polishingent://SD_ILS/0/SD_ILS:2894012024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Marinescu, Ioan D. Uhlmann, Eckart. Doi, Toshiro K., 1947-<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9781420017632">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Tribology in chemical-mechanical planarizationent://SD_ILS/0/SD_ILS:2884892024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Liang, Hong, 1961- Craven, David R., 1945-<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9781420028393">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Tribology in chemical-mechanical planarizationent://SD_ILS/0/SD_ILS:1195542024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Liang, Hong. Craven, David.<br/>Yer Numarası TJ1075 .L53 2005<br/>Format: Kitap<br/>Durum Beytepe Kütüphanesi~1<br/>Tribology of abrasive machining processesent://SD_ILS/0/SD_ILS:2564792024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Marinescu, Ioan D.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780815514909">http://www.sciencedirect.com/science/book/9780815514909</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Silicon Wafer Bonding Technology for VLSI and MEMS Applicationsent://SD_ILS/0/SD_ILS:2477772024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Iyer, S. S., ed. Auberton-Herv�, A. J., e<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1049/PBEP001E">http://dx.doi.org/10.1049/PBEP001E</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Chemical mechanical planarization of microelectronic materialsent://SD_ILS/0/SD_ILS:3008162024-11-11T06:21:48Z2024-11-11T06:21:48ZYazar Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim John Wiley <a href="http://dx.doi.org/10.1002/9783527617746">http://dx.doi.org/10.1002/9783527617746</a>
Contributor biographical information <a href="http://catdir.loc.gov/catdir/bios/wiley041/96006198.html">http://catdir.loc.gov/catdir/bios/wiley041/96006198.html</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>