Arama Sonuçları Integration. - Daraltılmış: Semiconductor wafers.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dIntegration.$0026qf$003dSUBJECT$002509Konu$002509Semiconductor$002bwafers.$002509Semiconductor$002bwafers.$0026ps$003d300?2024-09-20T19:20:16ZThrough-silicon vias for 3D integrationent://SD_ILS/0/SD_ILS:2934782024-09-20T19:20:16Z2024-09-20T19:20:16ZYazar Lau, John.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/throughsilicon-vias-for-3d-integration">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Handbook of 3D integration technology and applications of 3D integrated circuitsent://SD_ILS/0/SD_ILS:3036702024-09-20T19:20:16Z2024-09-20T19:20:16ZYazar Garrou, Philip E. Bower, Christopher Andrew. Ramm, Peter. Wiley InterScience (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://lib.myilibrary.com?id=418217">Connect to MyiLibrary resource.</a>
John Wiley <a href="http://dx.doi.org/10.1002/9783527623051">http://dx.doi.org/10.1002/9783527623051</a>
ebrary <a href="http://site.ebrary.com/id/10577606">http://site.ebrary.com/id/10577606</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Silicon Wafer Bonding Technology for VLSI and MEMS Applicationsent://SD_ILS/0/SD_ILS:2477772024-09-20T19:20:16Z2024-09-20T19:20:16ZYazar Iyer, S. S., ed. Auberton-Herv�, A. J., e<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1049/PBEP001E">http://dx.doi.org/10.1049/PBEP001E</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>