Arama Sonu&ccedil;lar&#305; Mechanical engineering. - Daralt&#305;lm&#305;&#351;: Electronic packaging. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dMechanical$002bengineering.$0026qf$003dSUBJECT$002509Konu$002509Electronic$002bpackaging.$002509Electronic$002bpackaging.$0026ic$003dtrue$0026te$003dILS$0026ps$003d300?dt=list 2024-12-24T19:30:06Z Handbook of lead-free solder technology for microelectronic assemblies ent://SD_ILS/0/SD_ILS:286357 2024-12-24T19:30:06Z 2024-12-24T19:30:06Z Yazar&#160;Puttlitz, Karl J.&#160;Stalter, Kathleen A.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://marc.crcnetbase.com/isbn/9780203021484">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> MEMS/MOEMS packaging concepts, designs, materials, and processes ent://SD_ILS/0/SD_ILS:293599 2024-12-24T19:30:06Z 2024-12-24T19:30:06Z Yazar&#160;Gilleo, Ken.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>