Arama Sonu&ccedil;lar&#305; Metals. - Daralt&#305;lm&#305;&#351;: Microtechnology. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dMetals.$0026qf$003dSUBJECT$002509Konu$002509Microtechnology.$002509Microtechnology.$0026te$003dILS$0026ps$003d300?dt=list 2026-03-24T08:18:21Z Microengineering of metals and ceramics ent://SD_ILS/0/SD_ILS:302268 2026-03-24T08:18:21Z 2026-03-24T08:18:21Z Yazar&#160;L&ouml;he, Detlef.&#160;Hausselt, J&uuml;rgen.&#160;Wiley InterScience (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1002/9783527616732">An electronic book accessible through the World Wide Web; click for information</a> Contributor biographical information <a href="http://catdir.loc.gov/catdir/enhancements/fy0627/2005283916-b.html">http://catdir.loc.gov/catdir/enhancements/fy0627/2005283916-b.html</a> John Wiley <a href="http://dx.doi.org/10.1002/9783527616725">http://dx.doi.org/10.1002/9783527616725</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Microengineering of metals and ceramics ent://SD_ILS/0/SD_ILS:109391 2026-03-24T08:18:21Z 2026-03-24T08:18:21Z Yazar&#160;L&ouml;he, Detlef.&#160;Hausselt, J&uuml;rgen.<br/>Yer Numaras&#305;&#160;QC176.8.M5 M53 2005 V.4/PT.2<br/>Format:&#160;Kitap<br/>Durum&#160;Beytepe K&uuml;t&uuml;phanesi~2<br/> Materials for Advanced Packaging ent://SD_ILS/0/SD_ILS:611028 2026-03-24T08:18:21Z 2026-03-24T08:18:21Z Yazar&#160;Lu, Daniel. editor.&#160;Wong, C.P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-45098-8">https://doi.org/10.1007/978-3-319-45098-8</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> 3D Microelectronic Packaging From Fundamentals to Applications ent://SD_ILS/0/SD_ILS:613043 2026-03-24T08:18:21Z 2026-03-24T08:18:21Z Yazar&#160;Li, Yan. editor.&#160;Goyal, Deepak. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-44586-1">https://doi.org/10.1007/978-3-319-44586-1</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Aluminum Matrix Composites Reinforced with Alumina Nanoparticles ent://SD_ILS/0/SD_ILS:616734 2026-03-24T08:18:21Z 2026-03-24T08:18:21Z Yazar&#160;Casati, Riccardo. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-319-27732-5">https://doi.org/10.1007/978-3-319-27732-5</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>