Arama Sonuçları Microelectronic packaging - Daraltılmış: Electronics.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dMicroelectronic$002bpackaging$0026qf$003dSUBJECT$002509Konu$002509Electronics.$002509Electronics.$0026ps$003d300?
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Force Sensors for Microelectronic Packaging Applications
ent://SD_ILS/0/SD_ILS:181096
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Yazar Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advances in embedded and fan-out wafer level packaging technologies
ent://SD_ILS/0/SD_ILS:594706
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Yazar Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.<br/>Yer Numarası TK7870.17 .A38 2019<br/>Elektronik Erişim <a href="https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>