Arama Sonuçları Microelectronic packaging.SirsiDynix Enterprisehttps://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dMicroelectronic$002bpackaging.$0026ps$003d300$0026isd$003dtrue?dt=list2024-11-25T21:30:42ZMicroelectronic packagingent://SD_ILS/0/SD_ILS:2900902024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Datta, Madhav. ?saka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9780203473689">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Force Sensors for Microelectronic Packaging Applicationsent://SD_ILS/0/SD_ILS:1810962024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testingent://SD_ILS/0/SD_ILS:2986532024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim Wiley InterScience <a href="http://dx.doi.org/10.1002/9780470827826">An electronic book accessible through the World Wide Web; click for information</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliabilityent://SD_ILS/0/SD_ILS:4601172024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Suganuma, Katsuaki, editor.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim ScienceDirect <a href="https://www.sciencedirect.com/science/book/9780081020944">https://www.sciencedirect.com/science/book/9780081020944</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Adhesion in microelectronicsent://SD_ILS/0/SD_ILS:3418442024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.<br/>Yer Numarası ONLINE(341844.1)<br/>Elektronik Erişim ebrary <a href="http://alltitles.ebrary.com/Doc?id=10910126">An electronic book accessible through the World Wide Web; click to view</a>
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John Wiley <a href="http://dx.doi.org/10.1002/9781118831373">http://dx.doi.org/10.1002/9781118831373</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>MEMS fundamental technology and applicationsent://SD_ILS/0/SD_ILS:2853962024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Choudhary, Vikas. Iniewski, Krzysztof.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9781466515826">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Semiconductor packaging materials interaction and reliabilityent://SD_ILS/0/SD_ILS:2889702024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Chen, Andrea. Lo, Randy.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9781439862070">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Introduction to microsystem packaging technologyent://SD_ILS/0/SD_ILS:2915512024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9781439865972">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Quantum-well laser array packaging nanoscale packaging techniquesent://SD_ILS/0/SD_ILS:2935902024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Tomm, Jens W. Jim�enez, J. (Juan)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/quantumwell-laser-array-packaging">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>3D IC stacking technologyent://SD_ILS/0/SD_ILS:2934932024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>MEMS/MOEMS packaging concepts, designs, materials, and processesent://SD_ILS/0/SD_ILS:2935992024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Gilleo, Ken.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Advanced electronic packagingent://SD_ILS/0/SD_ILS:2498222024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-<br/>Yer Numarası ONLINE<br/>Elektronik Erişim IEEE Xplore <a href="http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522">http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>Advanced electronic packagingent://SD_ILS/0/SD_ILS:2497652024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-<br/>Yer Numarası ONLINE<br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>IC component socketsent://SD_ILS/0/SD_ILS:3015812024-11-25T21:30:42Z2024-11-25T21:30:42ZYazar Liu, Weifeng. Pecht, Michael. John Wiley & Sons.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim John Wiley <a href="http://dx.doi.org/10.1002/0471648272">http://dx.doi.org/10.1002/0471648272</a>
Contributor biographical information <a href="http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html">http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>