Arama Sonu&ccedil;lar&#305; Microelectronic packaging. - Daralt&#305;lm&#305;&#351;: &Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dMicroelectronic$002bpackaging.$0026qf$003dLIBRARY$002509K$0025C3$0025BCt$0025C3$0025BCphane$0025091$00253AONLINE$002509$0025C3$002587evrimi$0025C3$0025A7i$002bK$0025C3$0025BCt$0025C3$0025BCphane$0026ic$003dtrue$0026ps$003d300$0026isd$003dtrue? 2024-12-01T18:13:01Z Microelectronic packaging ent://SD_ILS/0/SD_ILS:290090 2024-12-01T18:13:01Z 2024-12-01T18:13:01Z Yazar&#160;Datta, Madhav.&#160;?saka, Tetsuya, 1945-&#160;Schultze, J. W. (Joachim Walter)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://marc.crcnetbase.com/isbn/9780203473689">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Force Sensors for Microelectronic Packaging Applications ent://SD_ILS/0/SD_ILS:181096 2024-12-01T18:13:01Z 2024-12-01T18:13:01Z Yazar&#160;Schwizer, J&uuml;rg. author.&#160;Mayer, Michael. author.&#160;Brand, Oliver. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/b138345">http://dx.doi.org/10.1007/b138345</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing ent://SD_ILS/0/SD_ILS:298653 2024-12-01T18:13:01Z 2024-12-01T18:13:01Z Yazar&#160;Liu, S. (Sheng), 1963-&#160;Liu, Yong, 1962-&#160;Wiley InterScience (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;Wiley InterScience <a href="http://dx.doi.org/10.1002/9780470827826">An electronic book accessible through the World Wide Web; click for information</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability ent://SD_ILS/0/SD_ILS:460117 2024-12-01T18:13:01Z 2024-12-01T18:13:01Z Yazar&#160;Suganuma, Katsuaki, editor.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;ScienceDirect <a href="https://www.sciencedirect.com/science/book/9780081020944">https://www.sciencedirect.com/science/book/9780081020944</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Adhesion in microelectronics ent://SD_ILS/0/SD_ILS:341844 2024-12-01T18:13:01Z 2024-12-01T18:13:01Z Yazar&#160;Mittal, K. L., 1945- editor.&#160;Ahsan, Tanweer, editor.<br/>Yer Numaras&#305;&#160;ONLINE(341844.1)<br/>Elektronik Eri&#351;im&#160;ebrary <a href="http://alltitles.ebrary.com/Doc?id=10910126">An electronic book accessible through the World Wide Web; click to view</a> Ebook Library <a href="http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917">http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917</a> John Wiley <a href="http://dx.doi.org/10.1002/9781118831373">http://dx.doi.org/10.1002/9781118831373</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> MEMS fundamental technology and applications ent://SD_ILS/0/SD_ILS:285396 2024-12-01T18:13:01Z 2024-12-01T18:13:01Z Yazar&#160;Choudhary, Vikas.&#160;Iniewski, Krzysztof.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://marc.crcnetbase.com/isbn/9781466515826">Distributed by publisher. 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(Juan)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://mhebooklibrary.com/reader/quantumwell-laser-array-packaging">Subscription required</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> MEMS/MOEMS packaging concepts, designs, materials, and processes ent://SD_ILS/0/SD_ILS:293599 2024-12-01T18:13:01Z 2024-12-01T18:13:01Z Yazar&#160;Gilleo, Ken.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Introduction to microsystem packaging technology ent://SD_ILS/0/SD_ILS:291551 2024-12-01T18:13:01Z 2024-12-01T18:13:01Z Yazar&#160;Jin, Yufeng.&#160;Wang, Zhiping, 1962- Oct. 6-&#160;Chen, Jing, 1974-<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://marc.crcnetbase.com/isbn/9781439865972">Distributed by publisher. 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(Richard Kevin), 1955-<br/>Yer Numaras&#305;&#160;ONLINE<br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> IC component sockets ent://SD_ILS/0/SD_ILS:301581 2024-12-01T18:13:01Z 2024-12-01T18:13:01Z Yazar&#160;Liu, Weifeng.&#160;Pecht, Michael.&#160;John Wiley &amp; Sons.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;John Wiley <a href="http://dx.doi.org/10.1002/0471648272">http://dx.doi.org/10.1002/0471648272</a> Contributor biographical information <a href="http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html">http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>