Arama Sonuçları Microelectronic packaging. - Daraltılmış: 2011
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dMicroelectronic$002bpackaging.$0026qf$003dPUBDATE$002509Yay$0025C4$0025B1n$002bY$0025C4$0025B1l$0025C4$0025B1$0025092011$0025092011$0026te$003dILS$0026ps$003d300?dt=list
2024-12-25T21:31:27Z
Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing
ent://SD_ILS/0/SD_ILS:298653
2024-12-25T21:31:27Z
2024-12-25T21:31:27Z
Yazar Liu, S. (Sheng), 1963- Liu, Yong, 1962- Wiley InterScience (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim Wiley InterScience <a href="http://dx.doi.org/10.1002/9780470827826">An electronic book accessible through the World Wide Web; click for information</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Introduction to microsystem packaging technology
ent://SD_ILS/0/SD_ILS:291551
2024-12-25T21:31:27Z
2024-12-25T21:31:27Z
Yazar Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://marc.crcnetbase.com/isbn/9781439865972">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
3D IC stacking technology
ent://SD_ILS/0/SD_ILS:293493
2024-12-25T21:31:27Z
2024-12-25T21:31:27Z
Yazar Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Quantum-well laser array packaging nanoscale packaging techniques
ent://SD_ILS/0/SD_ILS:293590
2024-12-25T21:31:27Z
2024-12-25T21:31:27Z
Yazar Tomm, Jens W. Jim�enez, J. (Juan)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/quantumwell-laser-array-packaging">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
MEMS/MOEMS packaging concepts, designs, materials, and processes
ent://SD_ILS/0/SD_ILS:293599
2024-12-25T21:31:27Z
2024-12-25T21:31:27Z
Yazar Gilleo, Ken.<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>