Arama Sonu&ccedil;lar&#305; Microelectronic packaging. - Daralt&#305;lm&#305;&#351;: 2011 SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dMicroelectronic$002bpackaging.$0026qf$003dPUBDATE$002509Yay$0025C4$0025B1n$002bY$0025C4$0025B1l$0025C4$0025B1$0025092011$0025092011$0026te$003dILS$0026ps$003d300?dt=list 2024-12-25T21:31:27Z Modeling and simulation for microelectronic packaging assembly manufacture, reliability, and testing ent://SD_ILS/0/SD_ILS:298653 2024-12-25T21:31:27Z 2024-12-25T21:31:27Z Yazar&#160;Liu, S. (Sheng), 1963-&#160;Liu, Yong, 1962-&#160;Wiley InterScience (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;Wiley InterScience <a href="http://dx.doi.org/10.1002/9780470827826">An electronic book accessible through the World Wide Web; click for information</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Introduction to microsystem packaging technology ent://SD_ILS/0/SD_ILS:291551 2024-12-25T21:31:27Z 2024-12-25T21:31:27Z Yazar&#160;Jin, Yufeng.&#160;Wang, Zhiping, 1962- Oct. 6-&#160;Chen, Jing, 1974-<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://marc.crcnetbase.com/isbn/9781439865972">Distributed by publisher. Purchase or institutional license may be required for access.</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> 3D IC stacking technology ent://SD_ILS/0/SD_ILS:293493 2024-12-25T21:31:27Z 2024-12-25T21:31:27Z Yazar&#160;Wu, Banqiu.&#160;Kumar, Ajay.&#160;Ramaswami, Sesh.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://mhebooklibrary.com/reader/3d-ic-stacking-technology">Subscription required</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Quantum-well laser array packaging nanoscale packaging techniques ent://SD_ILS/0/SD_ILS:293590 2024-12-25T21:31:27Z 2024-12-25T21:31:27Z Yazar&#160;Tomm, Jens W.&#160;Jim&#65533;enez, J. (Juan)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://mhebooklibrary.com/reader/quantumwell-laser-array-packaging">Subscription required</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> MEMS/MOEMS packaging concepts, designs, materials, and processes ent://SD_ILS/0/SD_ILS:293599 2024-12-25T21:31:27Z 2024-12-25T21:31:27Z Yazar&#160;Gilleo, Ken.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://mhebooklibrary.com/reader/memsmoem-packaging">Subscription required</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>