Arama Sonuçları Microelectronics. - Daraltılmış: Heat engineering.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dMicroelectronics.$0026qf$003dSUBJECT$002509Konu$002509Heat$002bengineering.$002509Heat$002bengineering.$0026ic$003dtrue$0026ps$003d300?dt=list
2025-12-08T05:35:54Z
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
ent://SD_ILS/0/SD_ILS:530077
2025-12-08T05:35:54Z
2025-12-08T05:35:54Z
Yazar Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-1-4939-1556-9">https://doi.org/10.1007/978-1-4939-1556-9</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Thermal Sensors Principles and Applications for Semiconductor Industries
ent://SD_ILS/0/SD_ILS:530131
2025-12-08T05:35:54Z
2025-12-08T05:35:54Z
Yazar Jha, Chandra Mohan. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-1-4939-2581-0">https://doi.org/10.1007/978-1-4939-2581-0</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Thermal Transport in Oblique Finned Micro/Minichannels
ent://SD_ILS/0/SD_ILS:530267
2025-12-08T05:35:54Z
2025-12-08T05:35:54Z
Yazar Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-319-09647-6">https://doi.org/10.1007/978-3-319-09647-6</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>