Arama Sonuçları Microelectronics. - Daraltılmış: Materials.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dMicroelectronics.$0026qf$003dSUBJECT$002509Konu$002509Materials.$002509Materials.$0026pe$003dd$00253A$0026ps$003d300?dt=list
2026-01-15T20:29:13Z
Plasma applications for material modification : from microelectronics to biological materials
ent://SD_ILS/0/SD_ILS:564303
2026-01-15T20:29:13Z
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Yazar Tabarés, Francisco L., editor.<br/>Yer Numarası TA2020 .P53 2022<br/>Elektronik Erişim Taylor & Francis <a href="https://www.taylorfrancis.com/books/9781003119203">https://www.taylorfrancis.com/books/9781003119203</a>
OCLC metadata license agreement <a href="http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf">http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
ent://SD_ILS/0/SD_ILS:190315
2026-01-15T20:29:13Z
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Yazar Breitenstein, Otwin. author. Warta, Wilhelm. author. Langenkamp, Martin. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-3-642-02417-7">http://dx.doi.org/10.1007/978-3-642-02417-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Bonding in Microsystem Technology
ent://SD_ILS/0/SD_ILS:169225
2026-01-15T20:29:13Z
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Yazar Dziuban, Jan A. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/1-4020-4589-1">http://dx.doi.org/10.1007/1-4020-4589-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Selected Sensor Circuits From Data Sheet to Simulation
ent://SD_ILS/0/SD_ILS:526887
2026-01-15T20:29:13Z
2026-01-15T20:29:13Z
Yazar Baumann, Peter. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-658-38212-4">https://doi.org/10.1007/978-3-658-38212-4</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
ent://SD_ILS/0/SD_ILS:528603
2026-01-15T20:29:13Z
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Yazar Cocorullo, Giuseppe. editor. Crupi, Felice. editor. Limiti, Ernesto. editor. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-031-26066-7">https://doi.org/10.1007/978-3-031-26066-7</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Advanced Thermal Management Materials
ent://SD_ILS/0/SD_ILS:331292
2026-01-15T20:29:13Z
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Yazar Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE(331292.1)<br/>Elektronik Erişim <a href="http://dx.doi.org/10.1007/978-1-4614-1963-1">http://dx.doi.org/10.1007/978-1-4614-1963-1</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>