Arama Sonuçları Packaging -- Design. - Daraltılmış: Microelectromechanical systems.
SirsiDynix Enterprise
https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging$002b--$002bDesign.$0026qf$003dSUBJECT$002509Konu$002509Microelectromechanical$002bsystems.$002509Microelectromechanical$002bsystems.$0026ps$003d300?
2025-12-27T23:55:15Z
Chiplet Design and Heterogeneous Integration Packaging
ent://SD_ILS/0/SD_ILS:527684
2025-12-27T23:55:15Z
2025-12-27T23:55:15Z
Yazar Lau, John H. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
ent://SD_ILS/0/SD_ILS:529887
2025-12-27T23:55:15Z
2025-12-27T23:55:15Z
Yazar Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)<br/>Yer Numarası ONLINE<br/>Elektronik Erişim <a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format: Elektrnik Kaynak<br/>Durum Çevrimiçi Kütüphane~1<br/>
Microengineering, MEMS, and interfacing : a practical guide
ent://SD_ILS/0/SD_ILS:544843
2025-12-27T23:55:15Z
2025-12-27T23:55:15Z
Yazar Banks, Danny., author.<br/>Yer Numarası TK7875 .B36 2006<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9781420015416">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>
MEMS and Microstructures in aerospace applications
ent://SD_ILS/0/SD_ILS:547494
2025-12-27T23:55:15Z
2025-12-27T23:55:15Z
Yazar Osiander, Robert., author. Darrin, M. Ann Garrison. Champion, John.<br/>Yer Numarası TL589 .O85 2006<br/>Elektronik Erişim <a href="https://www.taylorfrancis.com/books/9781420027747">Click here to view.</a><br/>Format: Kitap<br/>Durum Çevrimiçi Kütüphane~1<br/>