Arama Sonu&ccedil;lar&#305; Packaging -- Design. - Daralt&#305;lm&#305;&#351;: Microtechnology. SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging$002b--$002bDesign.$0026qf$003dSUBJECT$002509Subject$002509Microtechnology.$002509Microtechnology.$0026ps$003d300? 2025-12-25T10:45:55Z Chiplet Design and Heterogeneous Integration Packaging ent://SD_ILS/0/SD_ILS:527684 2025-12-25T10:45:55Z 2025-12-25T10:45:55Z Yazar&#160;Lau, John H. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-981-19-9917-8">https://doi.org/10.1007/978-981-19-9917-8</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules ent://SD_ILS/0/SD_ILS:529887 2025-12-25T10:45:55Z 2025-12-25T10:45:55Z Yazar&#160;Fischer-Hirchert, Ulrich H. P. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="https://doi.org/10.1007/978-3-642-25376-8">https://doi.org/10.1007/978-3-642-25376-8</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/>