Arama Sonu&ccedil;lar&#305; Packaging. - Daralt&#305;lm&#305;&#351;: 2007 SirsiDynix Enterprise https://katalog.hacettepe.edu.tr/client/tr_TR/default_tr/default_tr/qu$003dPackaging.$0026qf$003dPUBDATE$002509Yay$0025C4$0025B1n$002bY$0025C4$0025B1l$0025C4$0025B1$0025092007$0025092007$0026ic$003dtrue$0026ps$003d300?dt=list 2024-11-26T22:30:18Z Fuel Cell Electronics Packaging ent://SD_ILS/0/SD_ILS:166371 2024-11-26T22:30:18Z 2024-11-26T22:30:18Z Yazar&#160;Kuang, Ken. editor.&#160;Easler, Keith. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/978-0-387-47324-6">http://dx.doi.org/10.1007/978-0-387-47324-6</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Integrated Circuit Packaging, Assembly and Interconnections ent://SD_ILS/0/SD_ILS:165984 2024-11-26T22:30:18Z 2024-11-26T22:30:18Z Yazar&#160;Greig, William J. author.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/0-387-33913-2">http://dx.doi.org/10.1007/0-387-33913-2</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Packaging for nonthermal processing of food ent://SD_ILS/0/SD_ILS:297158 2024-11-26T22:30:18Z 2024-11-26T22:30:18Z Yazar&#160;Han, Jung H.&#160;Wiley InterScience (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;Contributor biographical information <a href="http://catdir.loc.gov/catdir/enhancements/fy0802/2006036529-b.html">http://catdir.loc.gov/catdir/enhancements/fy0802/2006036529-b.html</a> John Wiley <a href="http://dx.doi.org/10.1002/9780470277720">http://dx.doi.org/10.1002/9780470277720</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Aseptic processing and packaging of food products ent://SD_ILS/0/SD_ILS:55258 2024-11-26T22:30:18Z 2024-11-26T22:30:18Z Yazar&#160;Holdworth, S. D.<br/>Yer Numaras&#305;&#160;TP 371.2 H65 1992<br/>Format:&#160;Kitap<br/>Durum&#160;Beytepe K&uuml;t&uuml;phanesi~1<br/> Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ent://SD_ILS/0/SD_ILS:165900 2024-11-26T22:30:18Z 2024-11-26T22:30:18Z Yazar&#160;Suhir, E. editor.&#160;Lee, Y. C. editor.&#160;Wong, C. P. editor.&#160;SpringerLink (Online service)<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://dx.doi.org/10.1007/0-387-32989-7">http://dx.doi.org/10.1007/0-387-32989-7</a><br/>Format:&#160;Elektrnik Kaynak<br/>Durum&#160;&Ccedil;evrimi&ccedil;i K&uuml;t&uuml;phane~1<br/> Intelligent and active packaging for fruits and vegetables ent://SD_ILS/0/SD_ILS:290341 2024-11-26T22:30:18Z 2024-11-26T22:30:18Z Yazar&#160;Wilson, Charles L.<br/>Yer Numaras&#305;&#160;ONLINE<br/>Elektronik Eri&#351;im&#160;<a href="http://marc.crcnetbase.com/isbn/9781420008678">Distributed by publisher. 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